Inventor

YANG KU-FENG

TW91 patents

⚠️ This page may combine multiple inventors who share the name “YANG KU-FENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

YANG KU-FENG

TAIWAN SEMICONDUCTOR MFG CO LTD

Dummy structure for chip-on-wafer-on-substrate

Isolation bonding film for semiconductor packages and methods of forming the same

TSV formation processes using TSV-last approach

TSV formation

Three dimensional integrated circuit structure and manufacturing method of the same

Self-alignment for redistribution layer

Semiconductor device having backside interconnect structure through substrate via and method of forming the same

Through-substrate vias with improved connections

Semiconductor device and method

Through substrate vias with improved connections

Semiconductor device and method

Semiconductor device and method

Dummy structure for chip-on-wafer-on-substrate

Through substrate vias with improved connections

Semiconductor device and method

Semiconductor device having backside interconnect structure on through substrate via and method of forming the same

Semiconductor device having backside interconnect structure on through substrate via and method of forming the same

Through-substrate vias with improved connections

Semiconductor structure comprising dummy feature interposed between the bonding connectors

Semiconductor device and method

Through via structure extending to metallization layer

Through-substrate via formation with improved topography control

TAIWAN SEMICONDUCTOR MFG

Three-dimensional integrated circuits with protection layers

Structure and method for stacked wafer fabrication

Three-dimensional integrated circuits with protection layers

Backside through vias in a bonded structure

TSV structures and methods for forming the same

Methods of forming semiconductor structures

Method for stacking semiconductor dies

Method for stacking semiconductor dies

Performing die-to-wafer stacking by filling gaps between dies

Interconnect structure and method of forming same

Through substrate via structures and methods of forming the same

TSV formation processes using TSV-last approach

TSV formation

Method for stacking semiconductor dies

YANG KU-FENG

Wafer bonding

Through substrate via structures and methods of forming the same

Cost-effective TSV formation

Backside process for a substrate

Method for thinning a wafer

Vacuum wafer carriers for strengthening thin wafers

Method for ultra thin wafer handling and processing

LIN JING-CHENG

TSV formation processes using TSV-last approach

Through-substrate vias with improved connections

LIN YUNG-CHI

TSV structures and methods for forming the same

YU CHEN-HUA

Three-dimensional integrated circuits with protection layers

CHEN HSIN-YU

Interconnect structure and method

LIU YUAN-HUNG

Integrated circuits including conductive structures through a substrate and methods of making the same

CHIOU WEN-CHIH

Semiconductor structures and methods of forming the same