Inventor

SHOBHA HOSADURGA K

US31 patents

⚠️ This page may combine multiple inventors who share the name “SHOBHA HOSADURGA K”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SHOBHA HOSADURGA K

IBM

Fully aligned via with integrated air gaps

Copper interconnect structure with manganese oxide barrier layer

Copper interconnect structure with manganese oxide barrier layer

Method of forming a copper based interconnect structure

Copper interconnect structure with manganese oxide barrier layer

Interconnect structure with barrier layer

Interconnect structure with capping layer and barrier layer

Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors

Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer

Via formation using sidewall image transfer process to define lateral dimension

Via formation using sidewall image transfer process to define lateral dimension

Advanced low k cap film formation process for nano electronic devices

Multilayer dielectric structures for semiconductor nano-devices

Multilayer dielectric structures for semiconductor nano-devices

Nitridization for semiconductor structures

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Ultrathin multilayer metal alloy liner for nano Cu interconnects

Nitridization for semiconductor structures

Advanced ultra low k SiCOH dielectrics prepared by built-in engineered pore size and bonding structured with cyclic organosilicon precursors

TESSERA INC

Interconnect structure

Copper interconnect structure with manganese barrier layer

Interconnect structure

VIRGINIA TECH INTELL PROP

High refractive index thermoplastic polyphosphonates

High refractive index thermoplastic polyphosphonates

JOHNSON & JOHNSON VISION CARE

High refractive index thermoplastic polyphosphonates

High refractive index thermoplastic polyphosphonates

GRILL ALFRED

Advanced low k cap film formation process for nano electronic devices

Advanced low k cap film formation process for nano electronic devices

EDELSTEIN DANIEL C

Barrier layer formation for metal interconnects through enhanced impurity diffusion

ARNOLD JOHN C

Methods to mitigate plasma damage in organosilicate dielectrics using a protective sidewall spacer

ESSILOR INT

High refractive index thermoplastic polyphosphonates