Inventor

LEITGEB MARKUS

AT40 patents

⚠️ This page may combine multiple inventors who share the name “LEITGEB MARKUS”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LEITGEB MARKUS

AT & S AUSTRIA TECH & SYSTEMTECHNIK AG

Electronic module with single or multiple components partially surrounded by a thermal decoupling gap

Hybrid component carrier and method for manufacturing the same

Heat removal mechanism for stack-based electronic device with process control component and processing components

Interposer-type component carrier and method of manufacturing the same

Component carrier with face-up and face-down embedded components

Interposer-type component carrier and method of manufacturing the same

Component carrier with two component carrier portions and a component being embedded in a blind opening of one of the component carrier portions

Protection layer for panel handling systems

Printed circuit board comprising an electronic component integrated therein

Component carrier with stack-stack connection for connecting components

Flame retardant structure for component carrier

Compensating misalignment of component carrier feature by modifying target design concerning correlated component carrier feature

Component carrier having a three dimensionally printed wiring structure

Component carrier with exposed layer

Component carrier with surface mounted components connected by high density connection region

Component embedded in component carrier and having an exposed side wall

Highly thermally conductive dielectric structure for heat spreading in component carrier

PCB-based connector device

Method for the production of a circuit board involving the removal of a subregion thereof

Cooling component carrier material by carbon structure within dielectric shell

Printed circuit board

Embedding known-good component in known-good cavity of known-good component carrier material with pre-formed electric connection structure

AUSTRIA TECH & SYSTEM TECH

Component carrier comprising a deformation counteracting structure

RF functionality and electromagnetic radiation shielding in a component carrier

Hybrid component carrier and method for manufacturing the same

Conductor track with enlargement-free transition between conductor path and contact structure

Matching inclination of cavity sidewall and medium supply device for manufacturing component carrier

Component carrier with integrated antenna structure

Printed circuit board

Electronic device with embedded electronic component

STAHR JOHANNES

Method for producing a flexi-rigid printed circuit board and flexi-rigid printed circuit board

Method for integrating an electronic component into a printed circuit board

WEIDINGER GERALD

Method for removing a part of a planar material layer and multilayer structure

Nonstick material, method for removing a part of a planar material layer and multilayer structure and use therefor

AT&S AUSTRIA TECH & SYSTEMTECHNIK AG

Semi-finished product for the production of a printed circuit board, method for producing a printed circuit board and printed circuit board

WEICHSLBERGER GUENTHER

Method for producing a multilayer printed circuit board, adhesion prevention material and multilayer printed circuit board and use of such a method

JOANNEUM RES FORSCHUNGSGMBH

Poly- or prepolymer composition, or embossing lacquer comprising such a composition and use thereof

AT&SAUSTRIA TECH & SYSTEMTECHNIK AG

Component embedded in component carrier and having an exposed side wall

AT&S AUSTRIA TECH & SYSTEMTECHNIK AKTIENGESCHAFT

Z-axis interconnection with protruding component

HASLEBNER NIKOLAI

Method for producing a circuit board consisting of a plurality of circuit board areas and circuit board