Inventor
BALDASSERONI CHLOE
US29 patents
Patents
29 patentsUS9428833B1Aug 30, 2016
Method and apparatus for backside deposition reduction by control of wafer support to achieve edge seal
LAM RES CORP353 citations97
US9508547B1Nov 29, 2016
Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactors
LAM RES CORP31 citations94
US9698042B1Jul 4, 2017
Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge
LAM RES CORP23 citations93
US9793096B2Oct 17, 2017
Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity
LAM RES CORP16 citations92
US10407773B2Sep 10, 2019
Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system
LAM RES CORP6 citations84
US10134579B2Nov 20, 2018
Method for high modulus ALD SiO2 spacer
LAM RES CORP13 citations84
US9617638B2Apr 11, 2017
Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system
LAM RES CORP9 citations84
US10665429B2May 26, 2020
Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity
LAM RES CORP6 citations83
US10378107B2Aug 13, 2019
Low volume showerhead with faceplate holes for improved flow uniformity
LAM RES CORP11 citations83
US11072860B2Jul 27, 2021
Fill on demand ampoule refill
LAM RES CORP6 citations82
US10622243B2Apr 14, 2020
Planar substrate edge contact with open volume equalization pathways and side containment
LAM RES CORP2 citations72
US9920844B2Mar 20, 2018
Valve manifold deadleg elimination via reentrant flow path
LAM RES CORP3 citations72
US9631276B2Apr 25, 2017
Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
LAM RES CORP2 citations72
US12040181B2Jul 16, 2024
Modulated atomic layer deposition
LAM RES CORP4 citations71
US9624578B2Apr 18, 2017
Method for RF compensation in plasma assisted atomic layer deposition
LAM RES CORP2 citations71
US11286560B2Mar 29, 2022
Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching
LAM RES CORP2 citations69
US10697059B2Jun 30, 2020
Thickness compensation by modulation of number of deposition cycles as a function of chamber accumulation for wafer to wafer film thickness matching
LAM RES CORP3 citations69
US11443975B2Sep 13, 2022
Planar substrate edge contact with open volume equalization pathways and side containment
LAM RES CORP0 citations62
US11127567B2Sep 21, 2021
Systems and methods for suppressing parasitic plasma and reducing within-wafer non-uniformity
LAM RES CORP0 citations62
US11959175B2Apr 16, 2024
Fill on demand ampoule refill
LAM RES CORP1 citations60
US12451346B2Oct 21, 2025
Modulated atomic layer deposition
LAM RES CORP0 citations59
US10526700B2Jan 7, 2020
Hardware and process for film uniformity improvement
LAM RES CORP0 citations52
US10100407B2Oct 16, 2018
Hardware and process for film uniformity improvement
LAM RES CORP1 citations52
US12110586B2Oct 8, 2024
Pedestals for modulating film properties in atomic layer deposition (ALD) substrate processing chambers
LAM RES CORP0 citations51
US10323323B2Jun 18, 2019
Systems and methods enabling low defect processing via controlled separation and delivery of chemicals during atomic layer deposition
LAM RES CORP0 citations51
US12142509B2Nov 12, 2024
Electrostatic chuck with seal surface
LAM RES CORP0 citations50
US10541117B2Jan 21, 2020
Systems and methods for tilting a wafer for achieving deposition uniformity
LAM RES CORP0 citations42
US10648079B2May 12, 2020
Reducing backside deposition at wafer edge
LAM RES CORP0 citations40
US9970108B2May 15, 2018
Systems and methods for vapor delivery in a substrate processing system
LAM RES CORP0 citations37