P

Inventor

PASQUALE FRANK L

US22 patents
⚠️ This page may combine multiple inventors who share the name “PASQUALE FRANK L”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LAM RES CORP

19 patents
US9892917B2Feb 13, 2018

Plasma assisted atomic layer deposition of multi-layer films for patterning applications

LAM RES CORP55 citations98
US9373500B2Jun 21, 2016

Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications

LAM RES CORP41 citations98
US10043657B2Aug 7, 2018

Plasma assisted atomic layer deposition metal oxide for patterning applications

LAM RES CORP23 citations94
US9673041B2Jun 6, 2017

Plasma assisted atomic layer deposition titanium oxide for patterning applications

LAM RES CORP26 citations94
US9570290B2Feb 14, 2017

Plasma assisted atomic layer deposition titanium oxide for conformal encapsulation and gapfill applications

LAM RES CORP29 citations94
US9508547B1Nov 29, 2016

Composition-matched curtain gas mixtures for edge uniformity modulation in large-volume ALD reactors

LAM RES CORP31 citations94
US9698042B1Jul 4, 2017

Wafer centering in pocket to improve azimuthal thickness uniformity at wafer edge

LAM RES CORP23 citations93
US10062563B2Aug 28, 2018

Selective atomic layer deposition with post-dose treatment

LAM RES CORP16 citations92
US10741365B2Aug 11, 2020

Low volume showerhead with porous baffle

LAM RES CORP7 citations84
US10679848B2Jun 9, 2020

Selective atomic layer deposition with post-dose treatment

LAM RES CORP10 citations84
US10407773B2Sep 10, 2019

Methods and apparatuses for showerhead backside parasitic plasma suppression in a secondary purge enabled ALD system

LAM RES CORP6 citations84
US11072860B2Jul 27, 2021

Fill on demand ampoule refill

LAM RES CORP6 citations82
US10049911B2Aug 14, 2018

Temporally pulsed and kinetically modulated CVD dielectrics for gapfill applications

LAM RES CORP2 citations73
US10418236B2Sep 17, 2019

Composite dielectric interface layers for interconnect structures

LAM RES CORP3 citations72
US10049869B2Aug 14, 2018

Composite dielectric interface layers for interconnect structures

LAM RES CORP4 citations72
US9624578B2Apr 18, 2017

Method for RF compensation in plasma assisted atomic layer deposition

LAM RES CORP2 citations71
US10526700B2Jan 7, 2020

Hardware and process for film uniformity improvement

LAM RES CORP0 citations52
US10100407B2Oct 16, 2018

Hardware and process for film uniformity improvement

LAM RES CORP1 citations52
US10541117B2Jan 21, 2020

Systems and methods for tilting a wafer for achieving deposition uniformity

LAM RES CORP0 citations42

NOVELLUS SYSTEMS INC

3 patents