Inventor

KIM CHIN-KWAN

US38 patents

⚠️ This page may combine multiple inventors who share the name “KIM CHIN-KWAN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KIM CHIN-KWAN

QUALCOMM INC

Thermal and electromagnetic interference shielding for die embedded in package substrate

System, apparatus, and method for split die interconnection

Integrated device comprising embedded package on package (PoP) device

Embedded bridge structure in a substrate

Ultra fine pitch and spacing interconnects for substrate

High aspect ratio interconnects in air gap of antenna package

Backside drill embedded die substrate

Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability

Substrate and method of forming the same

Package-on-package structure with reduced height

Package-on-Package (PoP) device comprising a gap controller between integrated circuit (IC) packages

Semiconductor package interconnections and method of making the same

Ultra fine pitch and spacing interconnects for substrate

Sub-module L-shaped millimeter wave antenna-in-package

Array type inductor

Semiconductor package with embedded components and method of making the same

Radio-frequency (RF) integrated circuit (IC) (RFIC) packages employing a substrate sidewall partial shield for electro-magnetic interference (EMI) shielding, and related fabrication methods

Power amplifier with RF structure

Surface finish on trace for a thermal compression flip chip (TCFC)

Substrate comprising inorganic material that lowers the coefficient of thermal expansion (CTE) and reduces warpage

Package with a substrate comprising protruding pad interconnects

Sub-module L-shaped millimeter wave antenna-in-package

Uniform via pad structure having covered traces between partially covered pads

Asymmetric antenna structure

Substrate comprising recessed interconnects and a surface mounted passive component

Enhanced antenna module with shield layer

Barrier layer on bump and non-wettable coating on trace

Integrated device comprising embedded package on package (PoP) device

Pattern between pattern for low profile substrate

Antenna modules employing a package substrate with a vertically-integrated patch antenna(s), and related fabrication methods

Package comprising discrete antenna device

Package substrate with testing pads on fine pitch traces

Integrated circuit (IC) package substrate with embedded trace substrate (ETS) layer on a substrate, and related fabrication methods

Conductive post protection for integrated circuit packages

Package substrate comprising surface interconnect and cavity comprising electroless fill

Providing a lower inductance path in a routing substrate for a capacitor, and related electronic devices and fabrication methods

KANG MYUNG SAM

Printed circuit board

KIM BYOUNG CHAN

Printed circuit board and semiconductor package with the same