Inventor
ALDRETE MANUEL
US15 patents
Patents
15 patentsUS10325855B2Jun 18, 2019
Backside drill embedded die substrate
QUALCOMM INC10 citations83
US10418333B1Sep 17, 2019
Waveguide along shielded side wall
QUALCOMM INC2 citations73
US10511268B2Dec 17, 2019
Segmented thermal and RF ground
QUALCOMM INC2 citations71
US10431511B2Oct 1, 2019
Power amplifier with RF structure
QUALCOMM INC4 citations71
US9466578B2Oct 11, 2016
Substrate comprising improved via pad placement in bump area
QUALCOMM INC3 citations71
US9269681B2Feb 23, 2016
Surface finish on trace for a thermal compression flip chip (TCFC)
QUALCOMM INC4 citations70
US9313881B2Apr 12, 2016
Through mold via relief gutter on molded laser package (MLP) packages
QUALCOMM INC3 citations68
US10325859B1Jun 18, 2019
Shielded stacked substrate apparatus and method of fabricating
QUALCOMM INC1 citations62
US8802556B2Aug 12, 2014
Barrier layer on bump and non-wettable coating on trace
QUALCOMM INC2 citations59
US11804428B2Oct 31, 2023
Mixed pad size and pad design
QUALCOMM INC0 citations58
US12463127B2Nov 4, 2025
Integrated circuit (IC) package employing a re-distribution layer (RDL) substrate(s) with photosensitive dielectric layer(s) for increased package rigidity, and related fabrication methods
QUALCOMM INC0 citations51
US10879191B2Dec 29, 2020
Conformal shielding for solder ball array
QUALCOMM INC0 citations51
US9768108B2Sep 19, 2017
Conductive post protection for integrated circuit packages
QUALCOMM INC0 citations50
US10490472B2Nov 26, 2019
Air cavity mold
QUALCOMM INC0 citations41
US10319694B2Jun 11, 2019
Semiconductor assembly and method of making same
QUALCOMM INC0 citations41