Inventor
SHAH MILIND PRAVIN
US7 patents
Patents
7 patentsUS9379090B1Jun 28, 2016
System, apparatus, and method for split die interconnection
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US9806063B2Oct 31, 2017
Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability
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US9484327B2Nov 1, 2016
Package-on-package structure with reduced height
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US9601435B2Mar 21, 2017
Semiconductor package with embedded components and method of making the same
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US9466578B2Oct 11, 2016
Substrate comprising improved via pad placement in bump area
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US10037941B2Jul 31, 2018
Integrated device package comprising photo sensitive fill between a substrate and a die
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US9768108B2Sep 19, 2017
Conductive post protection for integrated circuit packages
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