Inventor
CHONG CHOOI MEI
MY14 patents
⚠️ This page may combine multiple inventors who share the name “CHONG CHOOI MEI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INFINEON TECHNOLOGIES AG
6 patentsUS9368435B2Jun 14, 2016
Electronic component
INFINEON TECHNOLOGIES AG4 citations73
US11088105B2Aug 10, 2021
Semiconductor device and method for fabricating a semiconductor device
INFINEON TECHNOLOGIES AG2 citations72
US10147703B2Dec 4, 2018
Semiconductor package for multiphase circuitry device
INFINEON TECHNOLOGIES AG3 citations68
US11869865B2Jan 9, 2024
Semiconductor device having a contact clip with a contact region having a convex shape and method for fabricating thereof
INFINEON TECHNOLOGIES AG0 citations61
US11211356B2Dec 28, 2021
Power semiconductor package and method for fabricating a power semiconductor package
INFINEON TECHNOLOGIES AG0 citations53
US8853835B2Oct 7, 2014
Chip arrangements, a chip package and a method for manufacturing a chip arrangement
INFINEON TECHNOLOGIES AG1 citations52
INFINEON TECHNOLOGIES AUSTRIA AG
5 patentsUS9515060B2Dec 6, 2016
Multi-chip semiconductor power device
INFINEON TECHNOLOGIES AUSTRIA AG7 citations84
US9806029B2Oct 31, 2017
Transistor arrangement with semiconductor chips between two substrates
INFINEON TECHNOLOGIES AUSTRIA AG4 citations73
US10204845B2Feb 12, 2019
Semiconductor chip package having a repeating footprint pattern
INFINEON TECHNOLOGIES AUSTRIA AG2 citations72
US10699987B2Jun 30, 2020
SMD package with flat contacts to prevent bottleneck
INFINEON TECHNOLOGIES AUSTRIA AG0 citations41
US10037934B2Jul 31, 2018
Semiconductor chip package having contact pins at short side edges
INFINEON TECHNOLOGIES AUSTRIA AG0 citations37