Inventor
BAI DONGSHUN
US8 patents
⚠️ This page may combine multiple inventors who share the name “BAI DONGSHUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BREWER SCIENCE INC
5 patentsUS9827740B2Nov 28, 2017
Polyimides as laser release materials for 3-D IC applications
BREWER SCIENCE INC6 citations72
US10968348B2Apr 6, 2021
Laser-releasable bonding materials for 3-D IC applications
BREWER SCIENCE INC2 citations70
US9496164B2Nov 15, 2016
Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
BREWER SCIENCE INC4 citations68
US8865599B2Oct 21, 2014
Self-leveling planarization materials for microelectronic topography
BREWER SCIENCE INC3 citations60
US9865490B2Jan 9, 2018
Cyclic olefin polymer compositions and polysiloxane release layers for use in temporary wafer bonding processes
BREWER SCIENCE INC1 citations47
HONG WENBIN
3 patentsUS8092628B2Jan 10, 2012
Cyclic olefin compositions for temporary wafer bonding
HONG WENBIN17 citations91
US8771442B2Jul 8, 2014
Cyclic olefin compositions for temporary wafer bonding
HONG WENBIN1 citations61
US8221571B2Jul 17, 2012
Cyclic olefin compositions for temporary wafer bonding
HONG WENBIN4 citations61