Inventor
GOMI ATSUSHI
JP36 patents
⚠️ This page may combine multiple inventors who share the name “GOMI ATSUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
19 patentsUS7717061B2May 18, 2010
Gas switching mechanism for plasma processing apparatus
TOKYO ELECTRON LTD20 citations84
US10468237B2Nov 5, 2019
Substrate processing apparatus
TOKYO ELECTRON LTD3 citations73
US10049860B2Aug 14, 2018
Substrate processing apparatus
TOKYO ELECTRON LTD4 citations73
US9576850B2Feb 21, 2017
Method for manufacturing semiconductor device
TOKYO ELECTRON LTD2 citations73
US10309005B2Jun 4, 2019
Deposition device and deposition method
TOKYO ELECTRON LTD3 citations72
US9790590B2Oct 17, 2017
Vacuum-processing apparatus, vacuum-processing method, and storage medium
TOKYO ELECTRON LTD6 citations71
US9551060B2Jan 24, 2017
Film forming apparatus and film forming method
TOKYO ELECTRON LTD6 citations70
US8349283B2Jan 8, 2013
Metal recovery method, metal recovery apparatus, gas exhaust system and film forming device using same
TOKYO ELECTRON LTD4 citations63
US7892358B2Feb 22, 2011
System for introducing a precursor gas to a vapor deposition system
TOKYO ELECTRON LTD4 citations63
US7858522B2Dec 28, 2010
Method for reducing carbon monoxide poisoning in a thin film deposition system
TOKYO ELECTRON LTD3 citations63
US7491430B2Feb 17, 2009
Deposition method for forming a film including metal, nitrogen and carbon
TOKYO ELECTRON LTD5 citations63
US12018928B2Jun 25, 2024
Film thickness measurement method, film thickness measurement device, and film formation system
TOKYO ELECTRON LTD0 citations59
US11404255B2Aug 2, 2022
Sputtering method and sputtering apparatus
TOKYO ELECTRON LTD0 citations52
US9976217B2May 22, 2018
Film forming method using reversible decomposition reaction
TOKYO ELECTRON LTD1 citations52
US9064690B2Jun 23, 2015
Method for forming Cu wiring
TOKYO ELECTRON LTD0 citations52
US11894222B2Feb 6, 2024
Film forming apparatus and film forming method
TOKYO ELECTRON LTD0 citations50
US12180580B2Dec 31, 2024
Film forming position misalignment correction method and film forming system
TOKYO ELECTRON LTD0 citations49
US11551918B2Jan 10, 2023
Film forming apparatus
TOKYO ELECTRON LTD0 citations48
US12387922B2Aug 12, 2025
Film forming apparatus, processing condition determination method, and film forming method
TOKYO ELECTRON LTD0 citations47
HARA MASAMICHI
4 patentsUS9404180B2Aug 2, 2016
Deposition device
HARA MASAMICHI6 citations71
US9202728B2Dec 1, 2015
Substrate mounting mechanism, and substrate processing apparatus
HARA MASAMICHI2 citations61
US9062374B2Jun 23, 2015
Method for film formation, apparatus for film formation, and computer-readable recording medium
HARA MASAMICHI0 citations51
US8273409B2Sep 25, 2012
Method for film formation, apparatus for film formation, and computer-readable recording medium
HARA MASAMICHI0 citations51
IBM
3 patentsUS6989321B2Jan 24, 2006
Low-pressure deposition of metal layers from metal-carbonyl precursors
IBM41 citations92
US6924223B2Aug 2, 2005
Method of forming a metal layer using an intermittent precursor gas flow process
IBM32 citations91
US7078341B2Jul 18, 2006
Method of depositing metal layers from metal-carbonyl precursors
IBM12 citations84
ISHIZAKA TADAHIRO
3 patentsUS8399353B2Mar 19, 2013
Methods of forming copper wiring and copper film, and film forming system
ISHIZAKA TADAHIRO9 citations82
US8859422B2Oct 14, 2014
Method of forming copper wiring and method and system for forming copper film
ISHIZAKA TADAHIRO3 citations61
US8999841B2Apr 7, 2015
Semiconductor device manufacturing method
ISHIZAKA TADAHIRO0 citations51
GOMI ATSUSHI
3 patentsUS8992686B2Mar 31, 2015
Mounting table structure, film forming apparatus and raw material recovery method
GOMI ATSUSHI3 citations60
US8277889B2Oct 2, 2012
Film formation method and film formation apparatus
GOMI ATSUSHI2 citations60
US8408025B2Apr 2, 2013
Raw material recovery method and trapping mechanism for recovering raw material
GOMI ATSUSHI0 citations50