Inventor
MIZUSAWA YASUSHI
JP30 patents
⚠️ This page may combine multiple inventors who share the name “MIZUSAWA YASUSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TOKYO ELECTRON LTD
12 patentsUS7959985B2Jun 14, 2011
Method of integrating PEALD Ta-containing films into Cu metallization
TOKYO ELECTRON LTD61 citations98
US9896761B2Feb 20, 2018
Trap assembly in film forming apparatus
TOKYO ELECTRON LTD15 citations84
US8029873B2Oct 4, 2011
Film deposition method and film deposition apparatus of metal film
TOKYO ELECTRON LTD7 citations84
US7790626B2Sep 7, 2010
Plasma sputtering film deposition method and equipment
TOKYO ELECTRON LTD8 citations84
US8372739B2Feb 12, 2013
Diffusion barrier for integrated circuits formed from a layer of reactive metal and method of fabrication
TOKYO ELECTRON LTD8 citations80
US9576850B2Feb 21, 2017
Method for manufacturing semiconductor device
TOKYO ELECTRON LTD2 citations73
US8026176B2Sep 27, 2011
Film forming method, plasma film forming apparatus and storage medium
TOKYO ELECTRON LTD6 citations63
US7935393B2May 3, 2011
Method and system for improving sidewall coverage in a deposition system
TOKYO ELECTRON LTD3 citations63
US7799681B2Sep 21, 2010
Method for forming a ruthenium metal cap layer
TOKYO ELECTRON LTD4 citations62
US9976217B2May 22, 2018
Film forming method using reversible decomposition reaction
TOKYO ELECTRON LTD1 citations52
US9064690B2Jun 23, 2015
Method for forming Cu wiring
TOKYO ELECTRON LTD0 citations52
US8034406B2Oct 11, 2011
Integrated substrate processing in a vacuum processing tool
TOKYO ELECTRON LTD0 citations52
SHINETSU HANDOTAI KK
5 patentsUS10643908B2May 5, 2020
Manufacturing method and evaluation method of silicon epitaxial wafer
SHINETSU HANDOTAI KK3 citations73
US11205599B2Dec 21, 2021
Evaluation method of silicon epitaxial wafer
SHINETSU HANDOTAI KK0 citations62
US11175231B2Nov 16, 2021
Method for evaluating carbon concentration
SHINETSU HANDOTAI KK0 citations62
US8043871B2Oct 25, 2011
Method for forming oxide film on silicon wafer
SHINETSU HANDOTAI KK1 citations50
US10734220B2Aug 4, 2020
Method for manufacturing silicon epitaxial wafer and method for manufacturing semiconductor device
SHINETSU HANDOTAI KK0 citations41
ISHIZAKA TADAHIRO
3 patentsUS8399353B2Mar 19, 2013
Methods of forming copper wiring and copper film, and film forming system
ISHIZAKA TADAHIRO9 citations82
US8859422B2Oct 14, 2014
Method of forming copper wiring and method and system for forming copper film
ISHIZAKA TADAHIRO3 citations61
US8999841B2Apr 7, 2015
Semiconductor device manufacturing method
ISHIZAKA TADAHIRO0 citations51
GOMI ATSUSHI
3 patentsUS8992686B2Mar 31, 2015
Mounting table structure, film forming apparatus and raw material recovery method
GOMI ATSUSHI3 citations60
US8277889B2Oct 2, 2012
Film formation method and film formation apparatus
GOMI ATSUSHI2 citations60
US8408025B2Apr 2, 2013
Raw material recovery method and trapping mechanism for recovering raw material
GOMI ATSUSHI0 citations50