Inventor
IIJIMA TOMOO
JP20 patents
⚠️ This page may combine multiple inventors who share the name “IIJIMA TOMOO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TESSERA INTERCONNECT MATERIALS
6 patentsUS7342802B2Mar 11, 2008
Multilayer wiring board for an electronic device
TESSERA INTERCONNECT MATERIALS20 citations92
US7096578B2Aug 29, 2006
Manufacturing method for wiring circuit substrate
TESSERA INTERCONNECT MATERIALS15 citations92
US7238603B2Jul 3, 2007
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
TESSERA INTERCONNECT MATERIALS13 citations83
US7721422B2May 25, 2010
Methods of making microelectronic assemblies
TESSERA INTERCONNECT MATERIALS7 citations73
US7546681B2Jun 16, 2009
Manufacturing method for wiring circuit substrate
TESSERA INTERCONNECT MATERIALS6 citations73
US7505281B2Mar 17, 2009
Multilayer wiring board for an electronic device
TESSERA INTERCONNECT MATERIALS0 citations51
NORTH CORP
5 patentsUS6528874B1Mar 4, 2003
Wiring circuit substrate and manufacturing method thereof
NORTH CORP120 citations98
US6884709B2Apr 26, 2005
Connecting member between wiring films, manufacturing method thereof, and manufacturing method of multilayer wiring substrate
NORTH CORP50 citations95
US6828221B2Dec 7, 2004
Manufacturing method for wiring circuit substrates
NORTH CORP37 citations95
US6646337B2Nov 11, 2003
Wiring circuit substrate and manufacturing method therefor
NORTH CORP50 citations95
US6782610B1Aug 31, 2004
Method for fabricating a wiring substrate by electroplating a wiring film on a metal base
NORTH CORP141 citations91