Inventor
PENG CHEN-PIN
TW17 patents
⚠️ This page may combine multiple inventors who share the name “PENG CHEN-PIN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
KINGPAK TECH INC
15 patentsUS6400007B1Jun 4, 2002
Stacked structure of semiconductor means and method for manufacturing the same
KINGPAK TECH INC127 citations96
US6472736B1Oct 29, 2002
Stacked structure for memory chips
KINGPAK TECH INC66 citations94
US7423334B2Sep 9, 2008
Image sensor module with a protection layer and a method for manufacturing the same
KINGPAK TECH INC20 citations92
US7554599B2Jun 30, 2009
Image sensor module with air escape hole and a method for manufacturing the same
KINGPAK TECH INC17 citations83
US6642137B2Nov 4, 2003
Method for manufacturing a package structure of integrated circuits
KINGPAK TECH INC14 citations83
US7598580B1Oct 6, 2009
Image sensor module package structure with supporting element
KINGPAK TECH INC14 citations82
US11133348B2Sep 28, 2021
Sensor package structure and sensing module thereof
KINGPAK TECH INC3 citations72
US10411055B2Sep 10, 2019
Sensor package structure
KINGPAK TECH INC2 citations71
US10868062B2Dec 15, 2020
Sensor package structure
KINGPAK TECH INC4 citations70
US6642554B2Nov 4, 2003
Memory module structure
KINGPAK TECH INC2 citations54
US11735562B2Aug 22, 2023
Sensor package structure
KINGPAK TECH INC0 citations51
US9184331B2Nov 10, 2015
Method for reducing tilt of optical unit during manufacture of image sensor
KINGPAK TECH INC1 citations50
US8004602B2Aug 23, 2011
Image sensor structure and integrated lens module thereof
KINGPAK TECH INC1 citations50
US7235869B2Jun 26, 2007
Integrated circuit package having a resistant layer for stopping flowed glue
KINGPAK TECH INC0 citations36
US10600829B2Mar 24, 2020
Package base core and sensor package structure
KINGPAK TECH INC0 citations34