P

Inventor

TAKEZAWA YOSHITAKA

JP46 patents
⚠️ This page may combine multiple inventors who share the name “TAKEZAWA YOSHITAKA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HITACHI CHEMICAL CO LTD

17 patents
US11814568B2Nov 14, 2023

Anisotropic thermal conductive resin member and manufacturing method thereof

HITACHI CHEMICAL CO LTD2 citations73
US10800872B2Oct 13, 2020

Epoxy resin, epoxy resin composition, epoxy resin cured product, and composite material

HITACHI CHEMICAL CO LTD2 citations73
US11208525B2Dec 28, 2021

Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound

HITACHI CHEMICAL CO LTD2 citations72
US10597485B2Mar 24, 2020

Production methods for glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, storage methods for liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, glassy liquid-crystalline epoxy resin and glassy liquid-crystalline epoxy resin composition, liquid-crystalline epoxy resin and liquid-crystalline epoxy resin composition, and production method for cured epoxy resin

HITACHI CHEMICAL CO LTD5 citations72
US10662279B2May 26, 2020

Epoxy resin composition, semi-cured epoxy resin composition, cured epoxy resin composition, molded article, and cured molded article

HITACHI CHEMICAL CO LTD4 citations71
US10988585B2Apr 27, 2021

Resin sheet and cured product of resin sheet

HITACHI CHEMICAL CO LTD2 citations69
US12071714B2Aug 27, 2024

Anisotropic thermal conductive resin fiber, anisotropic thermal conductive resin member, and manufacturing method of these

HITACHI CHEMICAL CO LTD0 citations62
US11149109B2Oct 19, 2021

Epoxy resin composition, cured product and composite material

HITACHI CHEMICAL CO LTD0 citations62
US10934387B2Mar 2, 2021

Epoxy resin, epoxy resin composition, inorganic filler-containing epoxy resin composition, resin sheet, cured product, and epoxy compound

HITACHI CHEMICAL CO LTD0 citations62
US11840619B2Dec 12, 2023

Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

HITACHI CHEMICAL CO LTD1 citations61
US10584228B2Mar 10, 2020

Epoxy resin composition, thermally-conductive material precursor, B-stage sheet, prepreg, heat dissipation material, laminate, metal substrate, and printed circuit board

HITACHI CHEMICAL CO LTD1 citations61
US11840600B2Dec 12, 2023

Cured epoxy resin material, epoxy resin composition, molded article, and composite material

HITACHI CHEMICAL CO LTD0 citations52
US10941241B2Mar 9, 2021

Epoxy resin molding material, molded product, molded cured product, and method for producing molded cured product

HITACHI CHEMICAL CO LTD0 citations51
US10851200B2Dec 1, 2020

Resin composition and method of producing laminate

HITACHI CHEMICAL CO LTD0 citations48
US10590232B2Mar 17, 2020

Resin composition and method of producing laminate

HITACHI CHEMICAL CO LTD0 citations48
US10000679B2Jun 19, 2018

Phenolic resin composition

HITACHI CHEMICAL CO LTD0 citations41
US10373727B2Aug 6, 2019

Prepreg mica tape and coil using same

HITACHI CHEMICAL CO LTD0 citations39

HITACHI LTD

12 patents

SHOWA DENKO MATERIALS CO LTD

9 patents

RESONAC CORP

2 patents

UNIV KYOTO

1 patent

SUMITOMO CHEMICAL CO

1 patent

TAKEZAWA YOSHITAKA

1 patent

ROHM CO LTD

1 patent

RENESAS ELECTRONICS CORP

1 patent

RENESAS TECH CORP

1 patent