Inventor
PEI HAO-JAN
TW38 patents
Patents
38 patentsUS10566261B2Feb 18, 2020
Integrated fan-out packages with embedded heat dissipation structure
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86
US10276536B2Apr 30, 2019
Structure and formation method of chip package with fan-out structure
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US9524956B2Dec 20, 2016
Integrated fan-out structure and method
TAIWAN SEMICONDUCTOR MFG CO LTD8 citations84
US11211341B2Dec 28, 2021
Package structure and method of fabrcating the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11121089B2Sep 14, 2021
Integrated circuit package and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11069671B2Jul 20, 2021
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10978370B2Apr 13, 2021
Integrated fan-out packages with embedded heat dissipation structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10535644B1Jan 14, 2020
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US11862577B2Jan 2, 2024
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11309294B2Apr 19, 2022
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12581977B2Mar 17, 2026
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12564054B2Feb 24, 2026
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12564008B2Feb 24, 2026
Method and treatment system for uniform processing of semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12564055B2Feb 24, 2026
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12489030B2Dec 2, 2025
Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12417927B2Sep 16, 2025
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12388060B2Aug 12, 2025
Integrated fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368053B2Jul 22, 2025
Method for laser drilling process for an integrated circuit package
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266559B2Apr 1, 2025
Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12261088B2Mar 25, 2025
Package structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12230597B2Feb 18, 2025
Package structure with warpage-control element
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176319B2Dec 24, 2024
Reflow method and system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12107064B2Oct 1, 2024
Semiconductor package and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040309B2Jul 16, 2024
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11996400B2May 28, 2024
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942464B2Mar 26, 2024
Semiconductor package and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901258B2Feb 13, 2024
Iintegrated fan-out packages with embedded heat dissipation structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11830746B2Nov 28, 2023
Semiconductor device and method of manufacture
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11791192B2Oct 17, 2023
Workpiece holder, wafer chuck, wafer holding method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11721659B2Aug 8, 2023
Package structure with warpage-control element
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11610859B2Mar 21, 2023
Reflow method and system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11462507B2Oct 4, 2022
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342321B2May 24, 2022
Manufacturing method of package on package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11049832B2Jun 29, 2021
Formation method of package structure with warpage-control element
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10903090B2Jan 26, 2021
Method of singulate a package structure using a light transmitting film on a polymer layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12368149B2Jul 22, 2025
Methods of forming semiconductor packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10790261B2Sep 29, 2020
Bonding through multi-shot laser reflow
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US10658323B2May 19, 2020
Package structure with warpage-control element
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52