P

Inventor

CHANG CHIA-LUN

TW32 patents
⚠️ This page may combine multiple inventors who share the name “CHANG CHIA-LUN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

26 patents
US9570410B1Feb 14, 2017

Methods of forming connector pad structures, interconnect structures, and structures thereof

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations93
US10566261B2Feb 18, 2020

Integrated fan-out packages with embedded heat dissipation structure

TAIWAN SEMICONDUCTOR MFG CO LTD11 citations86
US10868353B2Dec 15, 2020

Electronic device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US10157862B1Dec 18, 2018

Integrated fan-out package and method of fabricating the same

TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11585992B2Feb 21, 2023

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US11417698B2Aug 16, 2022

Semiconductor package and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD4 citations73
US11121089B2Sep 14, 2021

Integrated circuit package and method

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US11002927B2May 11, 2021

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10978370B2Apr 13, 2021

Integrated fan-out packages with embedded heat dissipation structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10840199B2Nov 17, 2020

Methods of forming connector pad structures, interconnect structures, and structures thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10535644B1Jan 14, 2020

Manufacturing method of package on package structure

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US10515915B2Dec 24, 2019

Methods of forming connector pad structures, interconnect structures, and structures thereof

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations73
US10269739B2Apr 23, 2019

Methods of forming connector pad structures, interconnect structures, and structures thereof

TAIWAN SEMICONDUCTOR MFG CO LTD2 citations73
US9935067B2Apr 3, 2018

Methods of forming connector pad structures, interconnect structures, and structures thereof

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US9786542B2Oct 10, 2017

Mechanisms for forming semiconductor device having isolation structure

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations67
US12266673B2Apr 1, 2025

Semiconductor package and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations63
US12489030B2Dec 2, 2025

Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12417927B2Sep 16, 2025

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12368053B2Jul 22, 2025

Method for laser drilling process for an integrated circuit package

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11996400B2May 28, 2024

Manufacturing method of package on package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901258B2Feb 13, 2024

Iintegrated fan-out packages with embedded heat dissipation structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11874513B2Jan 16, 2024

Package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11830746B2Nov 28, 2023

Semiconductor device and method of manufacture

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11342321B2May 24, 2022

Manufacturing method of package on package structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10903090B2Jan 26, 2021

Method of singulate a package structure using a light transmitting film on a polymer layer

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11664300B2May 30, 2023

Fan-out packages and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51

ACER INC

4 patents

NOVATEK MICROELECTRONICS CORP

1 patent

OMNIVISION TECH INC

1 patent