Inventor

CHENG CHIA-SHEN

TW33 patents

⚠️ This page may combine multiple inventors who share the name “CHENG CHIA-SHEN”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CHENG CHIA-SHEN

TAIWAN SEMICONDUCTOR MFG CO LTD

Dicing in wafer level package

Integrated fan-out packages with embedded heat dissipation structure

Electronic device and manufacturing method thereof

Package structure and method of fabrcating the same

Package structure

Package structure with porous conductive structure and manufacturing method thereof

Semiconductor package and method

Package structure

Integrated fan-out packages with embedded heat dissipation structure

Dicing in wafer level package

Package structure and method of fabricating the same

Bonding through multi-shot laser reflow

Package structure

Package structure and method of fabricating the same

Methods of manufacturing integrated fan-out packages with embedded heat dissipation structure

Method for laser drilling process for an integrated circuit package

Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece

Reflow method and system

Bonding through multi-shot laser reflow

Semiconductor package and method

Iintegrated fan-out packages with embedded heat dissipation structure

Package structure

Package structure and manufacturing method thereof

Workpiece holder, wafer chuck, wafer holding method

Reflow method and system

Bonding through multi-shot laser reflow

Method of singulate a package structure using a light transmitting film on a polymer layer

Methods of forming semiconductor packages

Semiconductor structure and method

Bonding through multi-shot laser reflow

HSU HAN-CHUNG

Lens for light emitting diode (LED)

LEXTAR ELECTRONICS CORP

Illumination structure and assembly method of light base and cover

CHEN CHANG-HAN

Lamp