Inventor
WONG CHENG-SHIUAN
TW16 patents
Patents
16 patentsUS10868353B2Dec 15, 2020
Electronic device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD7 citations84
US11211341B2Dec 28, 2021
Package structure and method of fabrcating the same
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11862577B2Jan 2, 2024
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US12564055B2Feb 24, 2026
Package structure and method of fabricating the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12564008B2Feb 24, 2026
Method and treatment system for uniform processing of semiconductor devices
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12564054B2Feb 24, 2026
Package structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12538827B2Jan 27, 2026
Semiconductor structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12500219B2Dec 16, 2025
Trimming and sawing processes in the formation of wafer-form packages
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12266559B2Apr 1, 2025
Method of manufacturing semiconductor package, method of handling wafer, and method of handling workpiece
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12176319B2Dec 24, 2024
Reflow method and system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11942451B2Mar 26, 2024
Semiconductor structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11791192B2Oct 17, 2023
Workpiece holder, wafer chuck, wafer holding method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US11610859B2Mar 21, 2023
Reflow method and system
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US10903090B2Jan 26, 2021
Method of singulate a package structure using a light transmitting film on a polymer layer
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations62
US12543612B2Feb 3, 2026
Semiconductor devices and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11664300B2May 30, 2023
Fan-out packages and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations51