Inventor
GUO WANG
CN15 patents
⚠️ This page may combine multiple inventors who share the name “GUO WANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
BEIJING BOE OPTOELECTRONICS TECH CO LTD
10 patentsUS10991333B2Apr 27, 2021
Memory-in-pixel circuit and driving method thereof, and liquid crystal display panel including the same
BEIJING BOE OPTOELECTRONICS TECH CO LTD2 citations72
US10832608B2Nov 10, 2020
Pixel circuit, method for driving method, display panel, and display device
BEIJING BOE OPTOELECTRONICS TECH CO LTD1 citations61
US11691147B2Jul 4, 2023
Digital microfluidic chip and digital microfluidic system
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
US11407173B2Aug 9, 2022
Light valve panel and manufacturing method thereof, three-dimensional printing system and method
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
US11376596B2Jul 5, 2022
Microfluidic chip, testing apparatus and control method therefor
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
US11308853B2Apr 19, 2022
Shift register and driving method thereof, gate driving circuit and display apparatus
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
US11243648B2Feb 8, 2022
Touch panel, array substrate and display device
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
US11237381B2Feb 1, 2022
Electrowetting display panel, electrowetting display apparatus, method of driving electrowetting display panel, and method of fabricating electrowetting display panel
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
US11221422B2Jan 11, 2022
Pixel structure of flat panel detection device, flat panel detection device and camera system
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
US10706806B2Jul 7, 2020
Pixel driving circuit, array substrate and display device
BEIJING BOE OPTOELECTRONICS TECH CO LTD0 citations51
FUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD
2 patentsUS10600766B2Mar 24, 2020
Dual-channel heat-conducting encapsulation structure and encapsulation method of a solid-state phosphor integrated light source
FUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD0 citations40
US10504875B2Dec 10, 2019
Die-bonding substrate, high-density integrated COB white light source and method for manufacturing the same
FUJIAN CAS CERAMIC OPTOELECTRONICS TECH CO LTD0 citations30