Inventor

CUI ZHENJIANG

US48 patents

⚠️ This page may combine multiple inventors who share the name “CUI ZHENJIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

CUI ZHENJIANG

APPLIED MATERIALS INC

Chlorine-based hardmask removal

Cobalt-containing material removal

Cleaning high aspect ratio vias

Fluorine-based hardmask removal

Post treatment of low k dielectric films

Deposition process for high aspect ratio trenches

Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques

Adhesion improvement for low k dielectrics

Adhesion improvement for low k dielectrics to conductive materials

Fixture used to prepare semiconductor specimens for film adhesion testing

Air gap formation and integration using a patterning cap

Systems and methods for aluminum-containing film removal

Interface engineering to improve adhesion between low k stacks

Gapfill process using a combination of spin-on-glass deposition and chemical vapor deposition techniques

Apparatus and method for detecting an end point of chamber cleaning in semiconductor equipment

Multistep cure technique for spin-on-glass films

Metal recess for semiconductor structures

Chamber clean method using remote and in situ plasma cleaning systems

Systems and methods for etching metals and metal derivatives

Systems and methods for selective metal compound removal

Systems and methods for selective metal compound removal

HDP-CVD uniformity control

Method of preparing a sample of a semiconductor structure for adhesion testing

Chamber conditioning and removal processes

Etching of metal oxides using fluorine and metal halides

Systems and methods for tungsten-containing film removal

Etching of metal oxides using fluorine and metal halides

Method of in-situ selective metal removal via gradient oxidation for gapfill

Systems and methods for hafnium-containing film removal

Adhesion improvement for low k dielectrics

Metal deposition and etch in high aspect-ratio features

Metal recess for semiconductor structures

Techniques promoting adhesion of porous low K film to underlying barrier layer

Selective removal of ruthenium-containing materials

Metal etch in high aspect-ratio features

Integrated cluster to enable next generation interconnect

Air gap structure integration using a processing system

Integrated cluster to enable next generation interconnect

HKMG integration

Metal oxide directional removal

Systems and methods for nitride-containing film removal

Selective removal of transition metal nitride materials

3D NAND high aspect ratio structure etch

Two-step fluorine radical etch of hafnium oxide

NAIK MEHUL B

Process for damascene structure with reduced low-k damage

UNIV ILLINOIS

Method and apparatus for characterization of ultrathin silicon oxide films using mirror-enhanced polarized reflectance fourier transform infrared spectroscopy

CUI ZHENJIANG

Restoring low dielectric constant film properties

CHINA ACADEMY SPACE TECHNOLOGY

Menu-type design method for GEO satellite control system based on optimized information integration