Inventor
SHIRAI HIROSHI
JP84 patents
⚠️ This page may combine multiple inventors who share the name “SHIRAI HIROSHI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TYCO ELECTRONICS AMP KK
9 patentsUS7001197B2Feb 21, 2006
Land grid array socket
TYCO ELECTRONICS AMP KK91 citations98
US6976888B2Dec 20, 2005
LGA socket contact
TYCO ELECTRONICS AMP KK70 citations97
US6848927B2Feb 1, 2005
Card connecting structure and card connector used in the same
TYCO ELECTRONICS AMP KK23 citations93
US6425771B1Jul 30, 2002
IC socket
TYCO ELECTRONICS AMP KK28 citations92
US7291021B2Nov 6, 2007
IC socket and IC socket assembly
TYCO ELECTRONICS AMP KK15 citations84
US7083429B2Aug 1, 2006
IC socket
TYCO ELECTRONICS AMP KK17 citations84
US7785112B2Aug 31, 2010
Contact and electrical connector
TYCO ELECTRONICS AMP KK6 citations74
US7857633B2Dec 28, 2010
Contact and electrical connector
TYCO ELECTRONICS AMP KK4 citations63
US7226294B2Jun 5, 2007
Electrical connector
TYCO ELECTRONICS AMP KK6 citations63
TYCO ELECTRONICS JAPAN G K
6 patentsUS11177603B2Nov 16, 2021
Interposer
TYCO ELECTRONICS JAPAN G K6 citations84
US10454193B2Oct 22, 2019
Contact having a press-fit portion
TYCO ELECTRONICS JAPAN G K2 citations73
US9893480B2Feb 13, 2018
Connector
TYCO ELECTRONICS JAPAN G K6 citations72
US9203172B2Dec 1, 2015
Electrical connector assembly and electrical connector used therefor
TYCO ELECTRONICS JAPAN G K6 citations72
US10978820B2Apr 13, 2021
IC socket with contacts having a retained portion
TYCO ELECTRONICS JAPAN G K0 citations63
US11664619B2May 30, 2023
Interposer
TYCO ELECTRONICS JAPAN G K0 citations62
TE CONNECTIVITY CORP
4 patentsUS9923309B1Mar 20, 2018
PCB connector footprint
TE CONNECTIVITY CORP43 citations94
US10186810B2Jan 22, 2019
Shielding structure for a contact module
TE CONNECTIVITY CORP7 citations84
US9812817B1Nov 7, 2017
Electrical connector having a mating connector interface
TE CONNECTIVITY CORP15 citations84
US10741950B1Aug 11, 2020
Circuit card assemblies for a communication system
TE CONNECTIVITY CORP6 citations73
TOSHIBA CERAMICS CO
4 patentsUS6734960B1May 11, 2004
Wafer defect measuring method and apparatus
TOSHIBA CERAMICS CO34 citations90
US6025596AFeb 15, 2000
Method for measuring epitaxial film thickness of multilayer epitaxial wafer
TOSHIBA CERAMICS CO21 citations88
US5744401AApr 28, 1998
Silicon wafer manufacturing method eliminating final mirror-polishing step
TOSHIBA CERAMICS CO39 citations88
US5287167AFeb 15, 1994
Method for measuring interstitial oxygen concentration
TOSHIBA CERAMICS CO10 citations73
NIDEC TOSOK CORP
4 patentsUS11316399B2Apr 26, 2022
Electric actuator
NIDEC TOSOK CORP2 citations73
US11133727B2Sep 28, 2021
Electric actuator
NIDEC TOSOK CORP2 citations73
US10910911B2Feb 2, 2021
Electric actuator including two cases fixed to each other
NIDEC TOSOK CORP5 citations73
US10686348B2Jun 16, 2020
Electric actuator
NIDEC TOSOK CORP1 citations63
HITACHI LTD
3 patentsWHITAKER CORP
3 patentsFUJI PHOTO FILM CO LTD
3 patentsUS4502933AMar 5, 1985
Apparatus for electrolytic treatment to metal web
FUJI PHOTO FILM CO LTD8 citations73
US4390407AJun 28, 1983
Electrolytic processing device for belt-shaped metal plates
FUJI PHOTO FILM CO LTD7 citations73
US4597533AJul 1, 1986
Electrostatic spraying apparatus
FUJI PHOTO FILM CO LTD14 citations71
HONDA MOTOR CO LTD
2 patentsTE Connectivity Services Gmbh
2 patentsNIHON KAIHEIKI IND CO LTD
1 patentHITACHI MAXELL
1 patent(unassigned)
1 patentASAHI CHEMICAL IND
1 patentNEC CORP
1 patentTYCO ELECTRONICS EC K K
1 patentTYCO ELECTRONICS SHANGHAI CO LTD
1 patentTAE WEON
1 patentSOKOLA RAYMOND L
1 patentSANYO ELECTRIC CO
1 patentShowing the top 50 of 84 patents by PatentIndex Score.