Inventor

WOJNOWSKI MACIEJ

DE40 patents

⚠️ This page may combine multiple inventors who share the name “WOJNOWSKI MACIEJ”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WOJNOWSKI MACIEJ

INFINEON TECHNOLOGIES AG

Semiconductor packages with integrated antenna and method of forming thereof

Transition between a plastic waveguide and a semiconductor chip, where the semiconductor chip is embedded and encapsulated within a mold compound

Integrated antennas in wafer level package

Radar module with wafer level package and underfill

Integrated antennas in wafer level package

Wireless communication system, a radar system and a method for determining a position information of an object

Integrated antennas in wafer level package

Integrated antennas in wafer level package

Semiconductor device including an antenna

Chip package with substrate integrated waveguide and waveguide interface

Connector block with two sorts of through connections, and electronic device comprising a connector block

Integrated antennas in wafer level package

Selective activation of tire pressure monitoring system (TPMS) sensor modules for radio-frequency (RF) communication using directional RF beams

Common-mode suppressor based on differential transmission line

Integration of EBG structures (single layer/multi-layer) for isolation enhancement in multilayer embedded packaging technology at mmWave

Semiconductor device having an antenna arranged over an active main surface of a semiconductor die

Radio-frequency devices and methods for producing radio-frequency devices

Transmission of wireless signal having information on a local oscillator signal

Semiconductor package with integrated microwave component

Semiconductor devices comprising a radar semiconductor chip and associated production methods

Semiconductor devices comprising a radar semiconductor chip and associated production methods

Millimeter-wave system including a waveguide transition connected to a transmission line and surrounded by a plurality of vias

Method of forming a chip arrangement, chip arrangement, method of forming a chip package, and chip package

Semiconductor device including a passive component formed in a redistribution layer

Semiconductor package with plastic waveguide

Semiconductor devices having a non-galvanic connection

Method of manufacturing a semiconductor package having a semiconductor chip and a microwave component

Method of manufacturing a semiconductor package having an integrated microwave component

Semiconductor devices having cutouts in an encapsulation material and associated production methods

Functionalised redistribution layer

Electronic device including redistribution layer pad having a void

Integrated-circuit module with waveguide transition element

INFINEON TECHNOLOGIES AUSTRIA AG

Power semiconductor system having an inductor module attached to a power stage module

Method of manufacturing a power semiconductor system

Methods of manufacturing inductor modules and power semiconductor systems having inductor modules

Power semiconductor systems having inductor modules, and methods of manufacturing inductor modules and power semiconductor systems having inductor modules

BEER GOTTFRIED

Semiconductor packages with integrated antenna and methods of forming thereof

LACHNER RUDOLF

Integrated antennas in wafer level package

BOECK JOSEF

Integrated antennas in wafer level package

GEITNER OTTMAR

Chip package and a method for manufacturing a chip package