P

Inventor

NEWMAN MICHAEL

US53 patents
⚠️ This page may combine multiple inventors who share the name “NEWMAN MICHAEL”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INVENSAS CORP

20 patents
US9502390B2Nov 22, 2016

BVA interposer

INVENSAS CORP59 citations98
US10297582B2May 21, 2019

BVA interposer

INVENSAS CORP6 citations84
US8981564B2Mar 17, 2015

Metal PVD-free conducting structures

INVENSAS CORP11 citations84
US8884427B2Nov 11, 2014

Low CTE interposer without TSV structure

INVENSAS CORP13 citations84
US9312175B2Apr 12, 2016

Surface modified TSV structure and methods thereof

INVENSAS CORP5 citations72
US9123780B2Sep 1, 2015

Method and structures for heat dissipating interposers

INVENSAS CORP1 citations62
US10396114B2Aug 27, 2019

Method of fabricating low CTE interposer without TSV structure

INVENSAS CORP0 citations52
US10181411B2Jan 15, 2019

Method for fabricating a carrier-less silicon interposer

INVENSAS CORP0 citations52
US9893030B2Feb 13, 2018

Reliable device assembly

INVENSAS CORP0 citations52
US9558964B2Jan 31, 2017

Method of fabricating low CTE interposer without TSV structure

INVENSAS CORP0 citations52
US9398700B2Jul 19, 2016

Method of forming a reliable microelectronic assembly

INVENSAS CORP0 citations52
US9379008B2Jun 28, 2016

Metal PVD-free conducting structures

INVENSAS CORP0 citations52
US9355905B2May 31, 2016

Methods and structure for carrier-less thin wafer handling

INVENSAS CORP0 citations52
US9237648B2Jan 12, 2016

Carrier-less silicon interposer

INVENSAS CORP1 citations52
US9064933B2Jun 23, 2015

Methods and structure for carrier-less thin wafer handling

INVENSAS CORP0 citations52
US10475733B2Nov 12, 2019

Method and structures for heat dissipating interposers

INVENSAS CORP0 citations51
US10103094B2Oct 16, 2018

Method and structures for heat dissipating interposers

INVENSAS CORP0 citations51
US9685401B2Jun 20, 2017

Structures for heat dissipating interposers

INVENSAS CORP0 citations51
US10403510B2Sep 3, 2019

Method of fabricating a carrier-less silicon interposer using photo patterned polymer as substrate

INVENSAS CORP0 citations49
US9691693B2Jun 27, 2017

Carrier-less silicon interposer using photo patterned polymer as substrate

INVENSAS CORP0 citations49

NEWMAN MICHAEL

7 patents

PACCAR INC

5 patents

EASTMAN KODAK CO

4 patents

INTEL CORP

2 patents

ACCORDENT TECHNOLOGIES INC

2 patents

SEMANTIC MACHINES INC

2 patents

ALIBABA GROUP HOLDING LTD

2 patents

MESSER IND USA INC

2 patents

MCCORMICK STEPHEN A

1 patent

ENERGY LAB INC

1 patent

OHIO STEEL IND INC

1 patent

ROCKWELL COLLINS INC

1 patent

Showing the top 50 of 53 patents by PatentIndex Score.