Inventor

BHARATH KRISHNA

US51 patents

⚠️ This page may combine multiple inventors who share the name “BHARATH KRISHNA”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

BHARATH KRISHNA

INTEL CORP

Microelectronic assemblies having an integrated voltage regulator chiplet

Packaged device including a transmission line associated with one of a conductive shield, vertical stubs, and vertically interdigitated stubs

Low loss and low cross talk transmission lines using shaped vias

Apparatus and method to reduce power losses in an integrated voltage regulator

Direct bonding in microelectronic assemblies

Conformal power delivery structure for direct chip attach architectures

Microelectronic assemblies with inductors in direct bonding regions

Microelectronic assemblies having magnetic core inductors

Electrostatic discharge protection in integrated circuits

Package-integrated microchannels

Power delivery through capacitor-dies in a multi-layered microelectronic assembly

Microelectronic assemblies having an integrated voltage regulator chiplet

Device, method, and system to provide passivation structures of a magnetic material based inductor

Multi-phase switching regulators with hybrid inductors and per phase frequency control

High performance integrated RF passives using dual lithography process

Package-integrated multi-turn coil embedded in a package magnetic core

Low loss and low cross talk transmission lines with stacked dielectric layers for forming stubs of different thickness or for forming a coaxial line

Package including fully integrated voltage regulator circuitry within a substrate

Multi-layer embedded magnetic inductor coil

Package-integrated multi-turn coil embedded in a package magnetic core

Multi-level distributed clamps

Low loss and low cross talk transmission lines having l-shaped cross sections

High performance integrated RF passives using dual lithography process

Package power delivery using plane and shaped vias

Semiconductor packaging with high density interconnects

Package power delivery using plane and shaped vias

Magnetic core inductors on package substrates

Via-in-via structure for high density package integrated inductor

Apparatus and method to reduce power losses in an integrated voltage regulator

Stepped coax MIL PTHS for modulating inductance within a package

Integrated cross-domain power transfer voltage regulators

Magnetic core inductors in interposer

Package embedded magnetic power transformers for SMPS

Coaxial magnetic inductors with pre-fabricated ferrite cores

In situ inductor structure in buildup power planes

Packaging architecture for disaggregated integrated voltage regulators

Integrating voltage regulators and passive circuit elements with top side power planes in stacked die architectures

Power delivery structures

Integrated magnetic core inductors on glass core substrates

Dies with integrated voltage regulators

Fine-grained disaggregated server architecture

Integrated thin film capacitors on a glass core substrate

Reconfigurable inductor

Stacked magnetic inductor and method

KARHADE OMKAR G

Reliable microstrip routing for electronics components

Reliable microstrip routing for electronics components

Reliable microstrip routing for electronics components

ELSHERBINI ADEL A

Magnetic core inductor (MCI) structures for integrated voltage regulators

TAHOE RES LTD

Semiconductor packaging with high density interconnects

BHARATH KRISHNA

Multi-layer finite element method for modeling of package power and ground planes