Inventor

WANG JEN-YU

TW31 patents

⚠️ This page may combine multiple inventors who share the name “WANG JEN-YU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WANG JEN-YU

UNITED MICROELECTRONICS CORP

Oxide semiconductor transistor and manufacturing method thereof

Transistor and manufacturing method thereof

FinFET CMOS device including single diffusion break in each of NMOS and PMOS regions

Substrate of semiconductor device including epitaxial layer and silicon layer having same crystalline orientation

Magnetoresistive random-access memory

2-transistor 2-magnetic tunnel junction (2T2MTJ) MRAM structure

Spin-orbit torque magnetic random access memory circuit and layout thereof

MRAM circuit structure and layout structure

Bottom-pinned spin-orbit torque magnetic random access memory and method of manufacturing the same

Magnetic memory device having shared source line and bit line

Magnetic memory device having shared source line and bit line

Semiconductor device

Semiconductor device

Method of making FinFET CMOS device including single diffusion break in each of NMOS and PMOS regions

Memory including non-volatile cells and current driving circuit

Sense amplifier circuit with temperature compensation

Method for fabricating substrate of semiconductor device including epitaxial layer and silicon layer having same crystalline orientation

Layout pattern for magnetoresistive random access memory

PFET and CMOS containing same

TAIWAN SEMICONDUCTOR MFG CO LTD

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

Semiconductor device and manufacturing method thereof

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor package including thermal interface structures and methods of forming the same

Semiconductor device and manufacturing method thereof

Semiconductor device and manufacturing method thereof

Method of forming semiconductor package with composite thermal interface material structure

Semiconductor package with composite thermal interface material structure and method of forming the same

COOLER MASTER CO LTD

Heat-dissipating structure applied to at least one portable electronic device

Computer casing

WANG JEN-YU

Stylus and antenna thereof