P

Inventor

WU CHUNG-JUNG

TW17 patents
⚠️ This page may combine multiple inventors who share the name “WU CHUNG-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAIWAN SEMICONDUCTOR MFG CO LTD

12 patents
US11996351B2May 28, 2024

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD20 citations93
US11387164B2Jul 12, 2022

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD19 citations93
US11410910B2Aug 9, 2022

Packaged semiconductor device including liquid-cooled lid and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12341081B2Jun 24, 2025

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955405B2Apr 9, 2024

Semiconductor package including thermal interface structures and methods of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901263B2Feb 13, 2024

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631629B2Apr 18, 2023

Semiconductor device and manufacturing method thereof

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569147B2Jan 31, 2023

Method of forming semiconductor package with composite thermal interface material structure

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107747B2Aug 31, 2021

Semiconductor package with composite thermal interface material structure and method of forming the same

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9978709B2May 22, 2018

Solder bump stretching method for forming a solder bump joint in a device

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9475145B2Oct 25, 2016

Solder bump joint in a device including lamellar structures

TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US12500108B2Dec 16, 2025

Bonding system and method

TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47

SENSORTEK TECH CORP

3 patents

WISTRON CORP

1 patent

TSAI MENG-HAN

1 patent