Inventor
WU CHUNG-JUNG
TW17 patents
⚠️ This page may combine multiple inventors who share the name “WU CHUNG-JUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
12 patentsUS11996351B2May 28, 2024
Packaged semiconductor device including liquid-cooled lid and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD20 citations93
US11387164B2Jul 12, 2022
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD19 citations93
US11410910B2Aug 9, 2022
Packaged semiconductor device including liquid-cooled lid and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations72
US12341081B2Jun 24, 2025
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11955405B2Apr 9, 2024
Semiconductor package including thermal interface structures and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11901263B2Feb 13, 2024
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11631629B2Apr 18, 2023
Semiconductor device and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11569147B2Jan 31, 2023
Method of forming semiconductor package with composite thermal interface material structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11107747B2Aug 31, 2021
Semiconductor package with composite thermal interface material structure and method of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US9978709B2May 22, 2018
Solder bump stretching method for forming a solder bump joint in a device
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US9475145B2Oct 25, 2016
Solder bump joint in a device including lamellar structures
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations51
US12500108B2Dec 16, 2025
Bonding system and method
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations47
SENSORTEK TECH CORP
3 patentsUS12445129B2Oct 14, 2025
Proximity detection method and circuit thereof
SENSORTEK TECH CORP0 citations55
US11699996B2Jul 11, 2023
Method for proximity sensing and applied electronic device thereof
SENSORTEK TECH CORP0 citations55
US11811398B2Nov 7, 2023
Capacitance sensing device operation method
SENSORTEK TECH CORP0 citations53