Inventor
BOO KELVIN TAN AIK
SG23 patents
Patents
23 patentsUS12237301B2Feb 25, 2025
Through stack bridge bonding devices and associated methods
MICRON TECHNOLOGY INC2 citations74
US11527459B2Dec 13, 2022
Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods
MICRON TECHNOLOGY INC1 citations73
US11282811B2Mar 22, 2022
Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer
MICRON TECHNOLOGY INC5 citations73
US12564096B2Feb 24, 2026
Nested semiconductor assemblies and methods for making the same
MICRON TECHNOLOGY INC0 citations62
US12432859B2Sep 30, 2025
Surface mount device bonded to an inner layer of a multi-layer substrate
MICRON TECHNOLOGY INC0 citations62
US12354939B2Jul 8, 2025
Multi-role semiconductor device substrates, semiconductor device assemblies employing the same, and methods for forming the same
MICRON TECHNOLOGY INC0 citations62
US12293992B2May 6, 2025
Semiconductor assemblies with systems and methods for managing high die stack structures
MICRON TECHNOLOGY INC0 citations62
US12243807B2Mar 4, 2025
Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods
MICRON TECHNOLOGY INC0 citations62
US12148736B2Nov 19, 2024
Three-dimensional bonding scheme and associated systems and methods
MICRON TECHNOLOGY INC1 citations62
US11929351B2Mar 12, 2024
Integrated circuit wire bonded to a multi-layer substrate having an open area that exposes wire bond pads at a surface of the inner layer
MICRON TECHNOLOGY INC1 citations62
US11894289B2Feb 6, 2024
Substrates for semiconductor packages, including hybrid substrates for decoupling capacitors, and associated devices, systems, and methods
MICRON TECHNOLOGY INC0 citations62
US11723150B2Aug 8, 2023
Surface mount device bonded to an inner layer of a multi-layer substrate
MICRON TECHNOLOGY INC0 citations62
US11710722B2Jul 25, 2023
Semiconductor assemblies with systems and methods for managing high die stack structures
MICRON TECHNOLOGY INC0 citations62
US11562987B2Jan 24, 2023
Semiconductor devices with multiple substrates and die stacks
MICRON TECHNOLOGY INC0 citations62
US12374612B2Jul 29, 2025
Microelectronic device packages and related methods and systems
MICRON TECHNOLOGY INC0 citations60
US11688662B2Jun 27, 2023
Thermal distribution network for semiconductor devices and associated systems and methods
MICRON TECHNOLOGY INC0 citations55
US12532781B2Jan 20, 2026
Stacked capacitors for semiconductor devices and associated systems and methods
MICRON TECHNOLOGY INC0 citations52
US12525521B2Jan 13, 2026
Package substrate for a semiconductor device
MICRON TECHNOLOGY INC0 citations52
US12431418B2Sep 30, 2025
Three dimensional semiconductor trace length matching and associated systems and methods
MICRON TECHNOLOGY INC0 citations52
US12362255B2Jul 15, 2025
Apparatus including direct-contact heat paths and methods of manufacturing the same
MICRON TECHNOLOGY INC0 citations52
US12362319B2Jul 15, 2025
Cross stack bridge bonding devices and associated methods
MICRON TECHNOLOGY INC0 citations52
US12581976B2Mar 17, 2026
Wire bonding directly on exposed conductive vias and interconnects and related systems and methods
MICRON TECHNOLOGY INC0 citations51
US12412811B2Sep 9, 2025
Split via structure for semiconductor device packaging
MICRON TECHNOLOGY INC0 citations51