Inventor
PLOMBON JOHN J
US23 patents
⚠️ This page may combine multiple inventors who share the name “PLOMBON JOHN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
INTEL CORP
19 patentsUS7682891B2Mar 23, 2010
Tunable gate electrode work function material for transistor applications
INTEL CORP19 citations92
US7354849B2Apr 8, 2008
Catalytically enhanced atomic layer deposition process
INTEL CORP13 citations83
US12009018B2Jun 11, 2024
Transition metal dichalcogenide based spin orbit torque memory device
INTEL CORP2 citations73
US11393515B2Jul 19, 2022
Transition metal dichalcogenide based spin orbit torque memory device
INTEL CORP2 citations73
US11245068B2Feb 8, 2022
Transition metal dichalcogenide based magnetoelectric memory device
INTEL CORP2 citations73
US10068845B2Sep 4, 2018
Seam healing of metal interconnects
INTEL CORP3 citations73
US11696514B2Jul 4, 2023
Transition metal dichalcogenide based magnetoelectric memory device
INTEL CORP0 citations62
US11502188B2Nov 15, 2022
Apparatus and method for boosting signal in magnetoelectric spin orbit logic
INTEL CORP0 citations62
US10658487B2May 19, 2020
Semiconductor devices having ruthenium phosphorus thin films
INTEL CORP1 citations62
US7858525B2Dec 28, 2010
Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill
INTEL CORP5 citations62
US7749906B2Jul 6, 2010
Using unstable nitrides to form semiconductor structures
INTEL CORP3 citations62
US7476615B2Jan 13, 2009
Deposition process for iodine-doped ruthenium barrier layers
INTEL CORP3 citations62
US11626451B2Apr 11, 2023
Magnetic memory device with ruthenium diffusion barrier
INTEL CORP0 citations60
US12260296B1Mar 25, 2025
Diamondoid materials in quantum computing devices
INTEL CORP0 citations59
US10629525B2Apr 21, 2020
Seam healing of metal interconnects
INTEL CORP0 citations52
US10217646B2Feb 26, 2019
Transition metal dry etch by atomic layer removal of oxide layers for device fabrication
INTEL CORP0 citations51
US8344352B2Jan 1, 2013
Using unstable nitrides to form semiconductor structures
INTEL CORP0 citations51
US7982204B2Jul 19, 2011
Using unstable nitrides to form semiconductor structures
INTEL CORP0 citations51
US7704895B2Apr 27, 2010
Deposition method for high-k dielectric materials
INTEL CORP1 citations51