P

Inventor

PLOMBON JOHN J

US23 patents
⚠️ This page may combine multiple inventors who share the name “PLOMBON JOHN J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

INTEL CORP

19 patents
US7682891B2Mar 23, 2010

Tunable gate electrode work function material for transistor applications

INTEL CORP19 citations92
US7354849B2Apr 8, 2008

Catalytically enhanced atomic layer deposition process

INTEL CORP13 citations83
US12009018B2Jun 11, 2024

Transition metal dichalcogenide based spin orbit torque memory device

INTEL CORP2 citations73
US11393515B2Jul 19, 2022

Transition metal dichalcogenide based spin orbit torque memory device

INTEL CORP2 citations73
US11245068B2Feb 8, 2022

Transition metal dichalcogenide based magnetoelectric memory device

INTEL CORP2 citations73
US10068845B2Sep 4, 2018

Seam healing of metal interconnects

INTEL CORP3 citations73
US11696514B2Jul 4, 2023

Transition metal dichalcogenide based magnetoelectric memory device

INTEL CORP0 citations62
US11502188B2Nov 15, 2022

Apparatus and method for boosting signal in magnetoelectric spin orbit logic

INTEL CORP0 citations62
US10658487B2May 19, 2020

Semiconductor devices having ruthenium phosphorus thin films

INTEL CORP1 citations62
US7858525B2Dec 28, 2010

Fluorine-free precursors and methods for the deposition of conformal conductive films for nanointerconnect seed and fill

INTEL CORP5 citations62
US7749906B2Jul 6, 2010

Using unstable nitrides to form semiconductor structures

INTEL CORP3 citations62
US7476615B2Jan 13, 2009

Deposition process for iodine-doped ruthenium barrier layers

INTEL CORP3 citations62
US11626451B2Apr 11, 2023

Magnetic memory device with ruthenium diffusion barrier

INTEL CORP0 citations60
US12260296B1Mar 25, 2025

Diamondoid materials in quantum computing devices

INTEL CORP0 citations59
US10629525B2Apr 21, 2020

Seam healing of metal interconnects

INTEL CORP0 citations52
US10217646B2Feb 26, 2019

Transition metal dry etch by atomic layer removal of oxide layers for device fabrication

INTEL CORP0 citations51
US8344352B2Jan 1, 2013

Using unstable nitrides to form semiconductor structures

INTEL CORP0 citations51
US7982204B2Jul 19, 2011

Using unstable nitrides to form semiconductor structures

INTEL CORP0 citations51
US7704895B2Apr 27, 2010

Deposition method for high-k dielectric materials

INTEL CORP1 citations51

LAVOIE ADRIEN R

1 patent

SURFACE INTERFACE INC

1 patent

BLACKWELL JAMES M

1 patent

DOMINGUEZ JUAN E

1 patent