Inventor
LAI CHIA-CHU
TW29 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHIA-CHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
SILICONWARE PRECISION INDUSTRIES CO LTD
26 patentsUS12068211B2Aug 20, 2024
Electronic package comprising multiple wires inside an electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations84
US12014967B2Jun 18, 2024
Manufacturing method of electronic package comprising a wire within an electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations84
US11728234B2Aug 15, 2023
Electronic package comprising wire inside an electronic component and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD6 citations84
US12368081B2Jul 22, 2025
Electronic package comprising conductive layer connected electrode pad through electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations73
US12068535B2Aug 20, 2024
Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD4 citations73
US12526912B2Jan 13, 2026
Carrier structure
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12593698B2Mar 31, 2026
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12438266B2Oct 7, 2025
Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12334425B2Jun 17, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12293952B2May 6, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12100648B2Sep 24, 2024
Electronic module, manufacturing method thereof and electronic package having the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12100633B2Sep 24, 2024
Electronic package comprising wire inside an electronic component
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US11776897B2Oct 3, 2023
Electronic module, manufacturing method thereof and electronic package having the same
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US11223117B2Jan 11, 2022
Electronic package and electronic device having the electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US11081776B2Aug 3, 2021
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US12057618B2Aug 6, 2024
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US11682826B2Jun 20, 2023
Electronic package and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US12500145B2Dec 16, 2025
Electronic package and manufacturing method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US12027753B2Jul 2, 2024
Electronic package and antenna structure thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10840965B2Nov 17, 2020
Test system
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US10659097B1May 19, 2020
Testing system
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9698090B2Jul 4, 2017
Semiconductor substrate and fabrication method thereof
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9281557B2Mar 8, 2016
Multi bandwidth balun and circuit structure thereof
SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US9148113B2Sep 29, 2015
Balanced-to-unbalanced converter
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
US10840581B2Nov 17, 2020
Electronic package
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9503043B2Nov 22, 2016
Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexer
SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40