P

Inventor

LAI CHIA-CHU

TW29 patents
⚠️ This page may combine multiple inventors who share the name “LAI CHIA-CHU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

SILICONWARE PRECISION INDUSTRIES CO LTD

26 patents
US12068211B2Aug 20, 2024

Electronic package comprising multiple wires inside an electronic component

SILICONWARE PRECISION INDUSTRIES CO LTD4 citations84
US12014967B2Jun 18, 2024

Manufacturing method of electronic package comprising a wire within an electronic component

SILICONWARE PRECISION INDUSTRIES CO LTD4 citations84
US11728234B2Aug 15, 2023

Electronic package comprising wire inside an electronic component and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD6 citations84
US12368081B2Jul 22, 2025

Electronic package comprising conductive layer connected electrode pad through electronic component

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations73
US12068535B2Aug 20, 2024

Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD4 citations73
US12526912B2Jan 13, 2026

Carrier structure

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations62
US12593698B2Mar 31, 2026

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12438266B2Oct 7, 2025

Electronic package and manufacturing method thereof, and antenna module and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12334425B2Jun 17, 2025

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12293952B2May 6, 2025

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12100648B2Sep 24, 2024

Electronic module, manufacturing method thereof and electronic package having the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US12100633B2Sep 24, 2024

Electronic package comprising wire inside an electronic component

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US11776897B2Oct 3, 2023

Electronic module, manufacturing method thereof and electronic package having the same

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations61
US11223117B2Jan 11, 2022

Electronic package and electronic device having the electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US11081776B2Aug 3, 2021

Electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations60
US12057618B2Aug 6, 2024

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US11682826B2Jun 20, 2023

Electronic package and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations58
US12500145B2Dec 16, 2025

Electronic package and manufacturing method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US12027753B2Jul 2, 2024

Electronic package and antenna structure thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations51
US10840965B2Nov 17, 2020

Test system

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US10659097B1May 19, 2020

Testing system

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9698090B2Jul 4, 2017

Semiconductor substrate and fabrication method thereof

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations49
US9281557B2Mar 8, 2016

Multi bandwidth balun and circuit structure thereof

SILICONWARE PRECISION INDUSTRIES CO LTD1 citations49
US9148113B2Sep 29, 2015

Balanced-to-unbalanced converter

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations41
US10840581B2Nov 17, 2020

Electronic package

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40
US9503043B2Nov 22, 2016

Duplexer, circuit structure thereof and RF transceiver apparatus comprising the duplexer

SILICONWARE PRECISION INDUSTRIES CO LTD0 citations40

CHUANG MIN-HAN

2 patents

SILICONW ARE PREC INDUSTRIES CO LTD

1 patent