Inventor

HUANG HAN-HSIANG

TW19 patents

⚠️ This page may combine multiple inventors who share the name “HUANG HAN-HSIANG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

HUANG HAN-HSIANG

TAIWAN SEMICONDUCTOR MFG CO LTD

Multi-chip wafer level packages and methods of forming the same

Multi-chip packages and methods of forming the same

Multi-chip packages

Methods of forming multi-chip wafer level packages

Package structure and method of fabricating the same

Package structure and method of fabricating the same

Multi-chip wafer level packages

Bridging-resistant microbump structures and methods of forming the same

Basin-shaped underbump plates and methods of forming the same

MACROBLOCK INC

Method and apparatus for controlling the equivalent resistance of a converter

Power factor-corrected resonant converter and parallel power factor-corrected resonant converter

Common-core power factor correction resonant converter

REALTEK SEMICONDUCTOR CORP

Voltage reduction circuit for bandgap reference voltage circuit

Current generation circuit

Voltage regulator device

ADVANCED SEMICONDUCTOR ENG

Ball grid array semiconductor package having improved heat dissipation efficiency, overall electrical performance and enhanced bonding capability

Thermally enhanced BGA package

TAIWAN SEMICONDUCTOR MFG

Semiconductor structure with a discontinuous material density for reducing eddy currents

TAIWAN SEMICONDUTOR MFG COMPANY LTD

Power delivery structures and methods of manufacturing thereof