Inventor

Yang ting-li

TW20 patents

⚠️ This page may combine multiple inventors who share the name “Yang ting-li”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

Yang ting-li

TAIWAN SEMICONDUCTOR MFG CO LTD

Chip structure with conductive via structure and method for forming the same

Semiconductor device and method

Semiconductor device and method

Hybrid micro-bump integration with redistribution layer

Semiconductor device and method

Semiconductor device and method of forming the same

Micro-electro mechanical system and manufacturing method thereof

Semiconductor device and method

Semiconductor device structure with a protection cap at an end portion of a conductive line

Micro-electro mechanical system and manufacturing method thereof

Semiconductor device structure having protection caps on conductive lines

Hybrid micro-bump integration with redistribution layer

Semiconductor device and method

Method of forming semiconductor device having at least one via including concave portions on sidewall

Semiconductor device having at least one via including concave portions on sidewall

Bump integration with redistribution layer

Method of manufacturing an integrated inductor with protections caps on conductive lines

Semiconductor device structure and method for forming the same

IBM

Forming a solder joint between metal layers

Forming a solder joint between metal layers