Inventor
SHUE HONG-SENG
TW28 patents
⚠️ This page may combine multiple inventors who share the name “SHUE HONG-SENG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
TAIWAN SEMICONDUCTOR MFG CO LTD
24 patentsUS11088037B2Aug 10, 2021
Semiconductor device having probe pads and seal ring
TAIWAN SEMICONDUCTOR MFG CO LTD6 citations83
US11908790B2Feb 20, 2024
Chip structure with conductive via structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations74
US10861810B2Dec 8, 2020
Shielding structures
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations72
US11348884B1May 31, 2022
Organic interposer including a dual-layer inductor structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD4 citations71
US11075173B2Jul 27, 2021
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations71
US10049941B2Aug 14, 2018
Semiconductor isolation structure with air gaps in deep trenches
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations71
US12538836B2Jan 27, 2026
Seal ring structure in the peripheral of device dies and with zigzag patterns and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12087648B2Sep 10, 2024
Seal ring structure with zigzag patterns and method forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US11011462B2May 18, 2021
Method for forming fuse pad and bond pad of integrated circuit
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12598995B2Apr 7, 2026
Semiconductor device and method of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11854913B2Dec 26, 2023
Method for detecting defects in semiconductor device
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11855022B2Dec 26, 2023
Shielding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11380639B2Jul 5, 2022
Shielding structures
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations61
US11769741B2Sep 26, 2023
Organic interposer including a dual-layer inductor structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations60
US12142582B2Nov 12, 2024
Organic interposer including a dual-layer inductor structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US11342291B2May 24, 2022
Semiconductor packages with crack preventing structure
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations59
US12057423B2Aug 6, 2024
Bump integration with redistribution layer
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US12040289B2Jul 16, 2024
Interposer including a copper edge seal ring structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9558986B2Jan 31, 2017
Semiconductor structure and manufacturing method thereof
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52
US9614031B2Apr 4, 2017
Methods for forming a high-voltage super junction by trench and epitaxial doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US9093520B2Jul 28, 2015
High-voltage super junction by trench and epitaxial doping
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations50
US8953155B1Feb 10, 2015
Optical inspection system and optical inspection method
TAIWAN SEMICONDUCTOR MFG CO LTD1 citations50
US11848270B2Dec 19, 2023
Chip structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48
US8975153B2Mar 10, 2015
Super junction trench metal oxide semiconductor device and method of making the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations48