Inventor
Su Yu-Tse
TW7 patents
Patents
7 patentsUS10510734B2Dec 17, 2019
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations84
US10276548B2Apr 30, 2019
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD11 citations84
US11908790B2Feb 20, 2024
Chip structure with conductive via structure and method for forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD5 citations74
US10867976B2Dec 15, 2020
Semiconductor packages having dummy connectors and methods of forming same
TAIWAN SEMICONDUCTOR MFG CO LTD3 citations73
US10797005B2Oct 6, 2020
Semiconductor package and method for manufacturing the same
TAIWAN SEMICONDUCTOR MFG CO LTD2 citations72
US11329008B2May 10, 2022
Method for manufacturing semiconductor package for warpage control
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations62
US12040289B2Jul 16, 2024
Interposer including a copper edge seal ring structure and methods of forming the same
TAIWAN SEMICONDUCTOR MFG CO LTD0 citations52