Inventor

LIN HSIN FU

TW21 patents

⚠️ This page may combine multiple inventors who share the name “LIN HSIN FU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

LIN HSIN FU

TAIWAN SEMICONDUCTOR MFG CO LTD

3DIC structure for high voltage device on a SOI substrate

Semiconductor-on-insulator (SOI) semiconductor structures including a high-k dielectric layer and methods of manufacturing the same

Method for forming an integrated chip (IC) including forming a through substrate via (TSV) in an isolation structure formed in a first opening that formed in a metal substrate layer

Integrated chip (IC) having conductive TSV extended through SOI substrate comprising a semiconductor device layer, an insulating layer and a metal layer

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

Semiconductor device and method for manufacturing the same

High voltage device with boosted breakdown voltage

Semiconductor device and method for manufacturing the same

Semiconductor isolation structure and method for making the semiconductor isolation structure

Integrated chip with good thermal dissipation performance

Diode with reduced current leakage

Stepped isolation regions

Method for adjusting gate bias clamp voltage, semiconductor device, and bias clamp circuit using the same

Semiconductor device and method for manufacturing the same

Integration of low and high voltage devices on substrate

MACRONIX INT CO LTD

Fabrication method of non-volatile memory

Flash memory and fabrication method thereof

Semiconductor device and method of fabricating the same

PEACE SHIP INTERNAT ENTPR CO L

Movable projection screen hanger with steadfast clips

(unassigned)

Electric projection screen roller and balance rod assembly