Inventor
FUJINO JUNJI
JP46 patents
⚠️ This page may combine multiple inventors who share the name “FUJINO JUNJI”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
35 patentsUS5950908ASep 14, 1999
Solder supplying method, solder supplying apparatus and soldering method
MITSUBISHI ELECTRIC CORP58 citations94
US9818716B2Nov 14, 2017
Power module
MITSUBISHI ELECTRIC CORP8 citations81
US10096570B2Oct 9, 2018
Manufacturing method for power semiconductor device, and power semiconductor device
MITSUBISHI ELECTRIC CORP10 citations79
US11239123B2Feb 1, 2022
Semiconductor module, semiconductor device, and vehicle
MITSUBISHI ELECTRIC CORP2 citations73
US10978366B2Apr 13, 2021
Power module having a hole in a lead frame for improved adhesion with a sealing resin, electric power conversion device, and method for producing power module
MITSUBISHI ELECTRIC CORP3 citations72
US10431528B2Oct 1, 2019
Semiconductor device
MITSUBISHI ELECTRIC CORP3 citations72
US9917064B2Mar 13, 2018
Semiconductor device with a plate-shaped lead terminal
MITSUBISHI ELECTRIC CORP3 citations72
US9236316B2Jan 12, 2016
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP5 citations72
US5443659AAug 22, 1995
Flux for soldering and solder composition comprising the same and soldering method using the same
MITSUBISHI ELECTRIC CORP10 citations72
US11398447B2Jul 26, 2022
Semiconductor device and method for producing semiconductor device
MITSUBISHI ELECTRIC CORP2 citations71
US10559538B2Feb 11, 2020
Power module
MITSUBISHI ELECTRIC CORP2 citations71
US9899345B2Feb 20, 2018
Electrode terminal, semiconductor device for electrical power, and method for manufacturing semiconductor device for electrical power
MITSUBISHI ELECTRIC CORP6 citations71
US11538728B2Dec 27, 2022
Semiconductor package comprising a heat dissipation structure and an outer peripheral frame used as a resin flow barrier
MITSUBISHI ELECTRIC CORP2 citations70
US11004761B2May 11, 2021
Packaging of a semiconductor device with dual sealing materials
MITSUBISHI ELECTRIC CORP2 citations68
US10727163B2Jul 28, 2020
Semiconductor device
MITSUBISHI ELECTRIC CORP1 citations62
US9455215B2Sep 27, 2016
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP2 citations62
US9443778B2Sep 13, 2016
Semiconductor device and manufacturing method thereof
MITSUBISHI ELECTRIC CORP2 citations62
US9433075B2Aug 30, 2016
Electric power semiconductor device
MITSUBISHI ELECTRIC CORP2 citations62
US7622750B2Nov 24, 2009
Optical device package and optical semiconductor device using the same
MITSUBISHI ELECTRIC CORP5 citations62
US11424178B2Aug 23, 2022
Semiconductor module
MITSUBISHI ELECTRIC CORP1 citations60
US11557531B2Jan 17, 2023
Semiconductor device with metal film, power conversion device with the semiconductor device, and method of manufacturing the semiconductor device
MITSUBISHI ELECTRIC CORP0 citations59
US12183647B2Dec 31, 2024
Packaging of a semiconductor device with dual sealing materials
MITSUBISHI ELECTRIC CORP0 citations58
US12087651B2Sep 10, 2024
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations57
US7875901B2Jan 25, 2011
Optical device package and optical semiconductor device using the same
MITSUBISHI ELECTRIC CORP1 citations52
US9698091B2Jul 4, 2017
Power semiconductor device
MITSUBISHI ELECTRIC CORP1 citations51
US9691730B2Jun 27, 2017
Semiconductor device and method for manufacturing the same
MITSUBISHI ELECTRIC CORP0 citations51
US7626275B2Dec 1, 2009
Semiconductor device
MITSUBISHI ELECTRIC CORP1 citations51
US12062883B2Aug 13, 2024
Semiconductor module and method of manufacturing same
MITSUBISHI ELECTRIC CORP0 citations50
US11631623B2Apr 18, 2023
Power semiconductor device and method of manufacturing the same, and power conversion device
MITSUBISHI ELECTRIC CORP0 citations50
US11183479B2Nov 23, 2021
Semiconductor device, method for manufacturing the same, and power conversion device
MITSUBISHI ELECTRIC CORP0 citations50
US12255080B2Mar 18, 2025
Semiconductor manufacturing apparatus and method of manufacturing semiconductor device using the same, and semiconductor device
MITSUBISHI ELECTRIC CORP0 citations49
US11562979B2Jan 24, 2023
Power module and method of manufacturing the same, and power conversion apparatus
MITSUBISHI ELECTRIC CORP0 citations45
US7679181B2Mar 16, 2010
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations42
US10658284B2May 19, 2020
Shaped lead terminals for packaging a semiconductor device for electric power
MITSUBISHI ELECTRIC CORP0 citations40
US10204886B2Feb 12, 2019
Semiconductor device
MITSUBISHI ELECTRIC CORP0 citations40
ROHM CO LTD
6 patentsUS6781108B2Aug 24, 2004
Noise canceling photosensor-amplifier device
ROHM CO LTD12 citations74
US7838811B2Nov 23, 2010
Ambient light sensor
ROHM CO LTD5 citations71
US7554480B2Jun 30, 2009
Analog/digital converter, illuminance sensor, illumination device, and electronic device
ROHM CO LTD6 citations61
US8003930B2Aug 23, 2011
Ambient light sensor
ROHM CO LTD2 citations60
US9632543B2Apr 25, 2017
Mobile device
ROHM CO LTD0 citations51
US7509059B2Mar 24, 2009
Optical receiver and data communication apparatus comprising same
ROHM CO LTD0 citations41