Inventor
CHUN SUNG WOOK
KR10 patents
⚠️ This page may combine multiple inventors who share the name “CHUN SUNG WOOK”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
YMT CO LTD
8 patentsUS9758889B2Sep 12, 2017
Method for producing substrate formed with copper thin layer, method for manufacturing printed circuit board and printed circuit board manufactured thereby
YMT CO LTD5 citations69
US12534426B2Jan 27, 2026
Leveler and electroplating composition for filling via hole
YMT CO LTD0 citations55
US12495494B2Dec 9, 2025
Metal foil, carrier with metal foil comprising the same and printed circuit board including the same
YMT CO LTD1 citations54
US12408279B2Sep 2, 2025
Release layer for metal foil with carrier and metal foil comprising the same
YMT CO LTD0 citations53
US11499233B2Nov 15, 2022
Plated laminate and printed circuit board
YMT CO LTD0 citations52
US11028495B2Jun 8, 2021
Method for producing porous copper foil and porous copper foil produced by the same
YMT CO LTD0 citations49
US12139811B2Nov 12, 2024
Carrier foil-attached metal foil, method of manufacturing the same, and laminate including the same
YMT CO LTD0 citations47
US12522559B2Jan 13, 2026
Leveling agent and electrolytic composition for filling via hole
YMT CO LTD0 citations43