Inventor

LIN YI-TUNG

TW2 patents

⚠️ This page may combine multiple inventors who share the name “LIN YI-TUNG”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WINBOND ELECTRONICS CORP

1 patent

US7585754B2Sep 8, 2009

Method of forming bonding pad opening

WINBOND ELECTRONICS CORP4 citations57

NANYA TECHNOLOGY CORP

1 patent

US6772528B2Aug 10, 2004

Incremental offset measurement instrument

NANYA TECHNOLOGY CORP0 citations46