Inventor

TAKIAR HEM

US107 patents

⚠️ This page may combine multiple inventors who share the name “TAKIAR HEM”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

TAKIAR HEM

SANDISK CORP

IC memory card

Peripheral card with sloped edges

IC memory card

IC memory card

IC memory card

IC memory card

Stacked, interconnected semiconductor packages

Die package with asymmetric leadframe connection

Test pads on flash memory cards

SiP module with a single sided lid

Method of under-filling semiconductor die in a die stack and semiconductor device formed thereby

Leadframe based flash memory cards

Printed circuit board with coextensive electrical connectors and contact pad areas

COL-TSOP with nonconductive material for reducing package capacitance

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

Method of manufacturing flash memory cards

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

SIP based flash memory card

Memory card fabricated using SiP/SMT hybrid technology

Method of making a semiconductor device having multiple die redistribution layer

Semiconductor package including flip chip controller at bottom of die stack

Method of assembling semiconductor devices with LEDs

NAT SEMICONDUCTOR CORP

Low cost die sized module for imaging application having a lens housing assembly

Multi-station rotary die handling device

Integrated circuit packaged power supply

Method of separating micro-devices formed on a substrate

PTC fuse including external heat source

Liquid crystal display assembly for reducing optical defects

SANDISK TECHNOLOGIES INC

Semiconductor package including flip chip controller at bottom of die stack

Semiconductor package including flip chip controller at bottom of die stack

Method of stacking and interconnecting semiconductor packages via electrical connectors extending between adjoining semiconductor packages

System-in-a-package based flash memory card

Stacked, interconnected semiconductor package

SANDISK INFORMATION TECH SHANGHAI CO LTD

Semiconductor device including interconnected package on package

Angled die semiconductor device

Semiconductor device

Semiconductor package and method of fabricating semiconductor package

SANDISK TECHNOLOGIES LLC

Non-volatile memory system with wide I/O memory die

Wire bonded wide I/O semiconductor device

Semiconductor die singulation using a sacrificial bonding material layer and an anisotropic channel etch

MATSUSHITA ELECTRIC INDUSTRIAL CO LTD

IC memory card

WESTERN DIGITAL TECH INC

Manufacturing process for separating logic and memory array

UPADHYAYULA SURESH

Low profile wire bonded USB device

LEE MING HSUN

Die package with asymmetric leadframe connection

YU CHEEMEN

Two-sided die in a four-sided leadframe based package

TAKIAR HEM

Method of fabricating stacked semiconductor package with localized cavities for wire bonding

SANDISK SEMICONDUCTOR SHANGHAI CO LTD

Heterogeneous fan-out structures for memory devices

CHIU CHIN-TIEN

Rigid wave pattern design on chip carrier substrate and printed circuit board for semiconductor and electronic sub-system packaging

SANDISK INFORMATION TECH SHANGAHAI CO LTD

Vertical semiconductor device having a stacked die block

FU PENG

EMI shielding and thermal dissipation for semiconductor device