Inventor

KOSAKAI KAZUNARI

JP2 patents

Patents

2 patents

US6166433ADec 26, 2000

Resin molded semiconductor device and method of manufacturing semiconductor package

FUJITSU LTD59 citations93

US6281571B1Aug 28, 2001

Semiconductor device having an external connection electrode extending through a through hole formed in a substrate

FUJITSU LTD13 citations72