Inventor
SAWAI AKIYOSHI
JP13 patents
Patents
13 patentsUS5554887ASep 10, 1996
Plastic molded semiconductor package
MITSUBISHI ELECTRIC CORP168 citations98
US5666008ASep 9, 1997
Flip chip semiconductor device
MITSUBISHI ELECTRIC CORP114 citations97
US6046071AApr 4, 2000
Plastic molded semiconductor package and method of manufacturing the same
MITSUBISHI ELECTRIC CORP73 citations96
US5834340ANov 10, 1998
Plastic molded semiconductor package and method of manufacturing the same
MITSUBISHI ELECTRIC CORP50 citations96
US5814883ASep 29, 1998
Packaged semiconductor chip
MITSUBISHI ELECTRIC CORP313 citations96
US5710062AJan 20, 1998
Plastic molded semiconductor package and method of manufacturing the same
MITSUBISHI ELECTRIC CORP44 citations96
US6256875B1Jul 10, 2001
Method for manufacturing semiconductor device
MITSUBISHI ELECTRIC CORP50 citations95
US6177724B1Jan 23, 2001
Semiconductor device
MITSUBISHI ELECTRIC CORP56 citations95
US6005289ADec 21, 1999
Package for semiconductor device laminated printed circuit boards
MITSUBISHI ELECTRIC CORP30 citations91
US6457876B1Oct 1, 2002
Surface-mountable optical device
MITSUBISHI ELECTRIC CORP9 citations73
US6451622B1Sep 17, 2002
Optical device
MITSUBISHI ELECTRIC CORP7 citations73
US5903048AMay 11, 1999
Lead frame for semiconductor device
MITSUBISHI ELECTRIC CORP11 citations65
US11311970B2Apr 26, 2022
Shielding gas nozzle for metal forming and laser metal forming apparatus
MITSUBISHI ELECTRIC CORP0 citations49