Inventor

KURAFUCHI KAZUHIKO

JP22 patents

⚠️ This page may combine multiple inventors who share the name “KURAFUCHI KAZUHIKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

KURAFUCHI KAZUHIKO

HITACHI CHEMICAL CO LTD

Semiconductor device and method for manufacturing same

Copper paste for joining, method for producing joined body, and method for producing semiconductor device

Organic interposer and method for manufacturing organic interposer

Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

Organic interposer and method for manufacturing organic interposer

Copper paste for pressureless bonding, bonded body and semiconductor device

Resin composition, wiring layer laminate for semiconductor, and semiconductor device

Resin-sealed semiconductor device, and die bonding material and sealing material for use therein

Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device

Copper paste for joining, method for manufacturing joined body, and method for manufacturing semiconductor device

Structure containing conductor circuit, method for manufacturing same, and heat-curable resin composition

Assembly and semiconductor device

MITSUBISHI ELECTRIC CORP

Method for manufacturing semiconductor device

Package for semiconductor device laminated printed circuit boards

Evaluation board for evaluating electrical characteristics of an IC package

High density semiconductor device having inclined chip mounting

SHOWA DENKO MATERIALS CO LTD

Wiring board and method for manufacturing the same

Wiring board and production method for same

Substrate and method for manufacturing the same

Copper paste for pressureless bonding, bonded body and semiconductor device

RESONAC CORP

Semiconductor package

KURAFUCHI KAZUHIKO

Photosensitive resin composition for protective film of printed wiring board for semiconductor package