Inventor
POLIKS MARK DAVID
US13 patents
Patents
13 patentsUS6452117B2Sep 17, 2002
Method for filling high aspect ratio via holes in electronic substrates and the resulting holes
IBM76 citations95
US6351030B2Feb 26, 2002
Electronic package utilizing protective coating
IBM70 citations94
US5888850AMar 30, 1999
Method for providing a protective coating and electronic package utilizing same
IBM61 citations94
US6387205B1May 14, 2002
Dustfree prepreg and method for making an article based thereon
IBM16 citations92
US5928970AJul 27, 1999
Dustfree prepreg and method for making an article based thereon
IBM20 citations92
US5756405AMay 26, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM19 citations92
US6581280B2Jun 24, 2003
Method for filling high aspect ratio via holes in electronic substrates
IBM40 citations91
US5800874ASep 1, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM14 citations81
US6080684AJun 27, 2000
Dustfree prepreg and method for making an article based thereon
IBM6 citations73
US5773371AJun 30, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM6 citations73
US5773132AJun 30, 1998
Protecting copper dielectric interface from delamination
IBM13 citations72
US6071559AJun 6, 2000
Dustfree prepreg and method for making an article based thereon
IBM2 citations62
US5783252AJul 21, 1998
Technique for forming resin-impregnated fiberglass sheets
IBM2 citations62