Inventor
JACKSON JAMES DANIEL
US4 patents
Patents
4 patentsUS6856016B2Feb 15, 2005
Method and apparatus using nanotubes for cooling and grounding die
INTEL CORP94 citations96
US6713871B2Mar 30, 2004
Surface mount solder method and apparatus for decoupling capacitance and process of making
INTEL CORP45 citations94
US7135758B2Nov 14, 2006
Surface mount solder method and apparatus for decoupling capacitance and process of making
INTEL CORP5 citations72
US6627822B2Sep 30, 2003
Electronic assembly with separate power and signal connections
INTEL CORP10 citations72