Inventor
DISHONGH TERRANCE J
US42 patents
Patents
42 patentsUS6550531B1Apr 22, 2003
Vapor chamber active heat sink
INTEL CORP106 citations97
US6327145B1Dec 4, 2001
Heat sink with integrated fluid circulation pump
INTEL CORP100 citations97
US6856016B2Feb 15, 2005
Method and apparatus using nanotubes for cooling and grounding die
INTEL CORP94 citations96
US6452502B1Sep 17, 2002
Method and apparatus for early detection of reliability degradation of electronic devices
INTEL CORP78 citations96
US7663490B2Feb 16, 2010
Methods and apparatus for efficiently tracking activity using radio frequency identification
INTEL CORP29 citations93
US6884939B2Apr 26, 2005
Constructing of an electronic assembly having a decoupling capacitor
INTEL CORP28 citations93
US7316265B2Jan 8, 2008
Method for passive phase change thermal management
INTEL CORP18 citations92
US7158111B1Jan 2, 2007
Flexible display
INTEL CORP23 citations92
US6803527B2Oct 12, 2004
Circuit board with via through surface mount device contact
INTEL CORP22 citations92
US6752204B2Jun 22, 2004
Iodine-containing thermal interface material
INTEL CORP43 citations92
US6730860B2May 4, 2004
Electronic assembly and a method of constructing an electronic assembly
INTEL CORP23 citations92
US6672370B2Jan 6, 2004
Apparatus and method for passive phase change thermal management
INTEL CORP26 citations92
US6630631B1Oct 7, 2003
Apparatus and method for interconnection between a component and a printed circuit board
INTEL CORP27 citations92
US6486589B1Nov 26, 2002
Circuit card assembly having controlled vibrational properties
INTEL CORP33 citations92
US6366209B2Apr 2, 2002
Method and apparatus for early detection of reliability degradation of electronic devices
INTEL CORP24 citations92
US6255893B1Jul 3, 2001
Method and apparatus for detection of electrical overstress
INTEL CORP17 citations92
US6094144AJul 25, 2000
Method and apparatus for early detection of reliability degradation of electronic devices
INTEL CORP33 citations92
US7512486B2Mar 31, 2009
Fuel efficient navigation system
INTEL CORP27 citations91
US6580608B1Jun 17, 2003
Method and apparatus for thermally controlling multiple electronic components
INTEL CORP35 citations89
US7886809B2Feb 15, 2011
Apparatus and method for passive phase change thermal management
INTEL CORP9 citations84
US7168164B2Jan 30, 2007
Methods for forming via shielding
INTEL CORP11 citations82
US6461891B1Oct 8, 2002
Method of constructing an electronic assembly having an indium thermal couple and an electronic assembly having an indium thermal couple
INTEL CORP15 citations81
US6614657B2Sep 2, 2003
Heat sink for cooling an electronic component of a computer
INTEL CORP12 citations74
US6927346B2Aug 9, 2005
Surface mount technology to via-in-pad interconnections
INTEL CORP10 citations73
US6793505B2Sep 21, 2004
Ganged land grid array socket contacts for improved power delivery
INTEL CORP11 citations73
US6774310B1Aug 10, 2004
Surface mount connector lead
INTEL CORP9 citations73
US6682802B2Jan 27, 2004
Selective PCB stiffening with preferentially oriented fibers
INTEL CORP9 citations73
US6594151B2Jul 15, 2003
Frame support for a printed board assembly
INTEL CORP8 citations73
US6441675B1Aug 27, 2002
Method and apparatus for detection of electrical overstress
INTEL CORP5 citations73
US6433616B1Aug 13, 2002
Method and apparatus for detection of electrical overstress
INTEL CORP10 citations73
US6359372B1Mar 19, 2002
Circuit card assembly having controlled expansion properties
INTEL CORP9 citations73
US6627822B2Sep 30, 2003
Electronic assembly with separate power and signal connections
INTEL CORP10 citations72
US7185799B2Mar 6, 2007
Method of creating solder bar connections on electronic packages
INTEL CORP8 citations71
US6882043B2Apr 19, 2005
Electronic assembly having an indium thermal couple
INTEL CORP9 citations71
US6875367B2Apr 5, 2005
Attaching components to a printed circuit card
INTEL CORP6 citations71
US6818155B2Nov 16, 2004
Attaching components to a printed circuit card
INTEL CORP5 citations71
US6996899B2Feb 14, 2006
Electronic assembly and a method of constructing an electronic assembly
INTEL CORP4 citations63
US7041357B2May 9, 2006
Selective PCB stiffening with preferentially oriented fibers
INTEL CORP4 citations62
US7271349B2Sep 18, 2007
Via shielding for power/ground layers on printed circuit board
INTEL CORP6 citations61
US6878305B2Apr 12, 2005
Attaching components to a printed circuit card
INTEL CORP2 citations60
US7791585B2Sep 7, 2010
Method of fabricating flexible display
INTEL CORP0 citations52
US6793503B2Sep 21, 2004
Ganged land grid array socket contacts for improved power delivery
INTEL CORP0 citations51