Inventor
ALLEN TIMOTHY J
US32 patents
⚠️ This page may combine multiple inventors who share the name “ALLEN TIMOTHY J”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MICRON TECHNOLOGY INC
24 patentsUS6252772B1Jun 26, 2001
Removable heat sink bumpers on a quad flat package
MICRON TECHNOLOGY INC70 citations96
US6569727B1May 27, 2003
Method of making a single-deposition-layer-metal dynamic random access memory
MICRON TECHNOLOGY INC18 citations93
US6396131B1May 28, 2002
Stress reduction feature for LOC lead frame
MICRON TECHNOLOGY INC22 citations93
US4949161AAug 14, 1990
Interdigitized leadframe strip
MICRON TECHNOLOGY INC36 citations93
US4910866AMar 27, 1990
Method of manufacturing a series of leadframe strip carriers having fixed external dimensions and varied internal dimensions using a common mold
MICRON TECHNOLOGY INC27 citations92
US5021864AJun 4, 1991
Die-mounting paddle for mechanical stress reduction in plastic IC packages
MICRON TECHNOLOGY INC33 citations89
US6277225B1Aug 21, 2001
Stress reduction feature for LOC lead frame
MICRON TECHNOLOGY INC14 citations82
US5907166AMay 25, 1999
Single deposition layer metal dynamic random access memory
MICRON TECHNOLOGY INC13 citations82
US5717246AFeb 10, 1998
Hybrid frame with lead-lock tape
MICRON TECHNOLOGY INC12 citations82
US6635954B2Oct 21, 2003
Stress reduction feature for LOC lead frame
MICRON TECHNOLOGY INC8 citations74
US6545343B2Apr 8, 2003
Hybrid frame with lead-lock tape
MICRON TECHNOLOGY INC6 citations74
US6274928B1Aug 14, 2001
Single deposition layer metal dynamic random access memory
MICRON TECHNOLOGY INC10 citations74
US5897340AApr 27, 1999
Hybrid frame with lead-lock tape
MICRON TECHNOLOGY INC5 citations74
US7112252B2Sep 26, 2006
Assembly method for semiconductor die and lead frame
MICRON TECHNOLOGY INC2 citations63
US6737734B2May 18, 2004
Structure and method for securing bussing leads
MICRON TECHNOLOGY INC2 citations63
US6699734B2Mar 2, 2004
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC2 citations63
US6610162B1Aug 26, 2003
Methods for stress reduction feature for LOC lead frame
MICRON TECHNOLOGY INC3 citations63
US6600215B1Jul 29, 2003
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC1 citations63
US6251708B1Jun 26, 2001
Hybrid frame with lead-lock tape
MICRON TECHNOLOGY INC2 citations63
US6146922ANov 14, 2000
Hybrid frame with lead-lock tape
MICRON TECHNOLOGY INC1 citations63
US6008531ADec 28, 1999
Hybrid frame with lead-lock tape
MICRON TECHNOLOGY INC2 citations63
US6579746B2Jun 17, 2003
Method and apparatus for coupling a semiconductor die to die terminals
MICRON TECHNOLOGY INC0 citations52
US6388314B1May 14, 2002
Single deposition layer metal dynamic random access memory
MICRON TECHNOLOGY INC0 citations52
US6349034B2Feb 19, 2002
Removable heat sink bumpers on a quad flat package
MICRON TECHNOLOGY INC1 citations52
COOPER CAMERON CORP
6 patentsUS6516861B2Feb 11, 2003
Method and apparatus for injecting a fluid into a well
COOPER CAMERON CORP83 citations98
US6478087B2Nov 12, 2002
Apparatus and method for sensing the profile and position of a well component in a well bore
COOPER CAMERON CORP93 citations98
US6494267B2Dec 17, 2002
Wellhead assembly for accessing an annulus in a well and a method for its use
COOPER CAMERON CORP45 citations92
US6484807B2Nov 26, 2002
Wellhead assembly for injecting a fluid into a well and method of using the same
COOPER CAMERON CORP43 citations92
US6409176B2Jun 25, 2002
Wellhead housing seal assembly with backup feature
COOPER CAMERON CORP18 citations84
US6907961B2Jun 21, 2005
Apparatus and method for retarding translation between two bodies
COOPER CAMERON CORP7 citations73