Inventor

WARREN ROBERT W

US41 patents

⚠️ This page may combine multiple inventors who share the name “WARREN ROBERT W”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.

WARREN ROBERT W

WARREN ROBERT W

Systems and methods for re-designating memory regions as error code corrected memory regions

Systems and methods for circular buffering control in a memory device

Systems and methods for selecting bit per cell density of a memory cell based on data typing

Systems and methods for variable level use of a multi-level flash memory

Semiconductor packages with reduced solder voiding

Systems and methods of tamper proof packaging of a semiconductor device

Systems and methods for extended life multi-bit memory cells

Systems and methods for peak power and/or EMI reduction

Systems and methods for mobile data storage and acquisition

Wafer level package with thermal pad for higher power dissipation

Shielded USB connector module with molded hood and LED light pipe

Systems and methods for increasing bit density in a memory cell

Spot plated leadframe and IC bond pad via array design for copper wire

SKYWORKS SOLUTIONS INC

Overmolded semiconductor package with an integrated EMI and RFI shield

Method for fabricating a wafer level package with device wafer and passive component integration

Wafer level package including a device wafer integrated with a passive component

Wafer level package with cavities for active devices

GaAs integrated circuit device and method of attaching same

HOANG DINHPHUOC V

Overmolded semiconductor package with a wirebond cage for EMI shielding

Overmolded semiconductor package with a wirebond cage for EMI shielding

Overmolded semiconductor package with wirebonds for electromagnetic shielding

Methods for fabricating an overmolded semiconductor package with wirebonds for electromagnetic shielding

RAYTHEON CO

Three-dimensional component stacking using high density multichip interconnect decals and three-bond daisy-chained wedge bonds

Top of die chip-on-board encapsulation

High density multichip interconnect decal grid array with epoxy interconnects and transfer tape underfill

SYGHT INC

Millimeter wave display arrangement

Millimeter wave detector arrangement

Millimeter wavelength camera arrangement

DREIFUS DAVID L

Systems and methods for managing end of life in a solid state drive

Systems and methods for managing end of life in a solid state drive

CONEXANT SYSTEMS INC

Enhanced thermal dissipation ball grid array package

Semiconductor package with corner pins

SEAGATE TECHNOLOGY LLC

Using data compression to achieve lower linear bit densities on a storage medium

LSI CORP

Systems and methods for implementing error correction in relation to a flash memory

MCKEAN BRIAN D

Systems and methods for governing the life cycle of a solid state drive

SEAGATE TECHNOLOGIES LLC

Method and apparatus for read error recovery

BUCKHOLDT WAYNE L

Ultra fast disk access using arrays of fixed read/write transducers

CHANG LAI KEIN

Power management in data storage device determining utilization of a control circuit by its rate of command processing

WESTERN DIGITAL CORP

Pulsed alignment commutation state for sensorless motor start

KUHLMAN MARK A

3-D stacking of active devices over passive devices

ARNTZEN ESKILD T

Quantum burst arbiter and memory controller