Inventor
WAKUDA TOSHIMITSU
JP26 patents
⚠️ This page may combine multiple inventors who share the name “WAKUDA TOSHIMITSU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
FUKUYO FUMITSUGU
12 patentsUS8283595B2Oct 9, 2012
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU68 citations99
US8685838B2Apr 1, 2014
Laser beam machining method
FUKUYO FUMITSUGU93 citations98
US8227724B2Jul 24, 2012
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU31 citations96
US8969761B2Mar 3, 2015
Method of cutting a wafer-like object and semiconductor chip
FUKUYO FUMITSUGU10 citations93
US8927900B2Jan 6, 2015
Method of cutting a substrate, method of processing a wafer-like object, and method of manufacturing a semiconductor device
FUKUYO FUMITSUGU14 citations93
US8247734B2Aug 21, 2012
Laser beam machining method
FUKUYO FUMITSUGU29 citations92
US8946592B2Feb 3, 2015
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU3 citations74
US8946591B2Feb 3, 2015
Method of manufacturing a semiconductor device formed using a substrate cutting method
FUKUYO FUMITSUGU3 citations74
US8716110B2May 6, 2014
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU3 citations74
US8946589B2Feb 3, 2015
Method of cutting a substrate, method of cutting a wafer-like object, and method of manufacturing a semiconductor device
FUKUYO FUMITSUGU0 citations63
US8937264B2Jan 20, 2015
Laser processing method and laser processing apparatus
FUKUYO FUMITSUGU1 citations63
US8933369B2Jan 13, 2015
Method of cutting a substrate and method of manufacturing a semiconductor device
FUKUYO FUMITSUGU0 citations63
HAMAMATSU PHOTONICS KK
11 patentsUS7825350B2Nov 2, 2010
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK126 citations99
US7732730B2Jun 8, 2010
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK139 citations99
US7626137B2Dec 1, 2009
Laser cutting by forming a modified region within an object and generating fractures
HAMAMATSU PHOTONICS KK130 citations99
US7615721B2Nov 10, 2009
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK118 citations99
US7592238B2Sep 22, 2009
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK123 citations99
US7547613B2Jun 16, 2009
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK144 citations99
US7396742B2Jul 8, 2008
Laser processing method for cutting a wafer-like object by using a laser to form modified regions within the object
HAMAMATSU PHOTONICS KK167 citations99
US6992026B2Jan 31, 2006
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK447 citations99
US9837315B2Dec 5, 2017
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK8 citations93
US10796959B2Oct 6, 2020
Laser processing method and laser processing apparatus
HAMAMATSU PHOTONICS KK3 citations84
US7626746B2Dec 1, 2009
Shutter unit and laser processing device using same
HAMAMATSU PHOTONICS KK3 citations61