Inventor
MORIMOTO NOBORU
JP13 patents
⚠️ This page may combine multiple inventors who share the name “MORIMOTO NOBORU”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MITSUBISHI ELECTRIC CORP
6 patentsUS6624516B2Sep 23, 2003
Structure for connecting interconnect lines with interposed layer including metal layers and metallic compound layer
MITSUBISHI ELECTRIC CORP25 citations92
US6664641B2Dec 16, 2003
Wiring structure for an integrated circuit
MITSUBISHI ELECTRIC CORP17 citations83
US6399424B1Jun 4, 2002
Method of manufacturing contact structure
MITSUBISHI ELECTRIC CORP11 citations73
US6509648B1Jan 21, 2003
Method of manufacturing semiconductor device and semiconductor device
MITSUBISHI ELECTRIC CORP2 citations62
US10892363B2Jan 12, 2021
Semiconductor device having termination region with insulator films having different coefficients of moisture absorption
MITSUBISHI ELECTRIC CORP0 citations61
US10686068B2Jun 16, 2020
Semiconductor device having termination region with insulator having low coefficient of moisture absorption
MITSUBISHI ELECTRIC CORP0 citations51
RENESAS TECH CORP
4 patentsUS6734489B2May 11, 2004
Semiconductor element and MIM-type capacitor formed in different layers of a semiconductor device
RENESAS TECH CORP31 citations92
US7714413B2May 11, 2010
Semiconductor device and method of manufacture thereof
RENESAS TECH CORP10 citations83
US6780769B2Aug 24, 2004
Method of manufacturing structure for connecting interconnect lines including metal layer with thickness larger than thickness of metallic compound layer
RENESAS TECH CORP11 citations73
US6737319B2May 18, 2004
Method of manufacturing semiconductor device and semiconductor device
RENESAS TECH CORP3 citations62