Inventor
IZUMITANI JUNKO
JP21 patents
⚠️ This page may combine multiple inventors who share the name “IZUMITANI JUNKO”. Patents are grouped by organization below to help distinguish them — per-person disambiguation is on the roadmap.
MURATA MANUFACTURING CO
9 patentsUS11217395B2Jan 4, 2022
Capacitor
MURATA MANUFACTURING CO4 citations73
US11101072B2Aug 24, 2021
Capacitor with limited substrate capacitance
MURATA MANUFACTURING CO2 citations72
US11011548B2May 18, 2021
Electronic device and method of manufacturing the same
MURATA MANUFACTURING CO3 citations72
US11587738B2Feb 21, 2023
Capacitor
MURATA MANUFACTURING CO0 citations62
US11521800B2Dec 6, 2022
Capacitor
MURATA MANUFACTURING CO0 citations62
US11232911B2Jan 25, 2022
Capacitor
MURATA MANUFACTURING CO0 citations62
US11476055B2Oct 18, 2022
Thin film capacitor and method of manufacturing the same
MURATA MANUFACTURING CO0 citations52
US11474063B2Oct 18, 2022
Semiconductor device having a porous metal oxide film and a semiconductor substrate with a connection electrically connected to the porous metal oxide film
MURATA MANUFACTURING CO0 citations52
US10177289B2Jan 8, 2019
Mounting substrate
MURATA MANUFACTURING CO0 citations39
MITSUBISHI ELECTRIC CORP
6 patentsUS6476491B2Nov 5, 2002
Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion and method for fabricating the same
MITSUBISHI ELECTRIC CORP75 citations96
US6016562AJan 18, 2000
Inspection data analyzing apparatus for in-line inspection with enhanced display of inspection results
MITSUBISHI ELECTRIC CORP49 citations92
US6333259B1Dec 25, 2001
Semiconductor device and apparatus and method for manufacturing the same
MITSUBISHI ELECTRIC CORP8 citations73
US6500675B2Dec 31, 2002
Manufacturing method of semiconductor device having capacitive element
MITSUBISHI ELECTRIC CORP10 citations70
US6476496B1Nov 5, 2002
Semiconductor device and method of manufacturing the same
MITSUBISHI ELECTRIC CORP4 citations62
US6645863B2Nov 11, 2003
Method of manufacturing semiconductor device and semiconductor device
MITSUBISHI ELECTRIC CORP1 citations50
RENESAS TECH CORP
5 patentsUS6727590B2Apr 27, 2004
Semiconductor device with internal bonding pad
RENESAS TECH CORP100 citations97
US7423301B2Sep 9, 2008
Semiconductor device including fuse elements and bonding pad
RENESAS TECH CORP2 citations62
US7217965B2May 15, 2007
Semiconductor device including fuse elements and bonding pad
RENESAS TECH CORP4 citations62
US6890857B2May 10, 2005
Semiconductor device having a multilayer wiring structure and pad electrodes protected from corrosion, and method for fabricating the same
RENESAS TECH CORP2 citations62
US7335537B2Feb 26, 2008
Method of manufacturing semiconductor device including bonding pad and fuse elements
RENESAS TECH CORP0 citations52